Motorola Corporation

Temic Automotive of North America, Inc.

John T Meagher

Jen-Huang Albert Chiou

Jeffrey Yin

David J Anderson

Youngkee Ahn

The disclosure provides a tire pressure sensor assembly that includes a battery and a printed circuit board (PCB) configured with electronics to measure tire pressure and to transmit an electromagnetic signal related to the measured tire pressure. The PCB and battery are contained in a housing that allows the PCB and the battery to be angularly oriented with respect to each other. Such orientation permits the sensor to conform to the curved surface of the rim. An embodiment of the disclosed tire pressure sensor assembly is adapted to fasten to a valve stem via a metal terminal. The attachment configuration permits the valve stem assembly to deform as the valve stem is installed in a rim and also allows the valve stem to function as a portion of the antenna structure to facilitate transmitting the RF signal to a receiver.

Tire pressure sensor assembly

A tire pressure sensor assembly including a valve stem that can be preassembled and snap installed into a tire rim is disclosed. The tire pressure sensor assembly includes a valve stem and a printed circuit board configured with electronics for sensing tire pressure and transmitting radio frequency data related to tire pressure. The circuit board is rigidly connected to the valve stem. The valve stem and the electronics are contained in a unitary, integrated housing that is deformable to allow the valve stem portion of the assembly to be press fit into the rim opening. So installed, the assembly is securely mounted to the rim, but is no more time consuming to install than a conventional valve stem.

Package for a tire pressure sensor assembly

According to an exemplary embodiment, the present technique relates to a fuel sensor for determining operational fuel level (h) in a fuel tank (). In the exemplary embodiment, an isolated airspace () is created. By monitoring the pressure conditions in the isolated airspaceas well as the pressure and temperature conditions in the remainder () of the tank (), the operational fuel level (h) may be determined.

Fuel level sensor

A process for fabricating an electronic module (,) and a packaged electronic device (,) having a thermally conductive substrate includes the step of thermally spraying of a dielectric layer (,) onto a baseplate (,). An electrically conductive layer (,) is then direct bonded to the thermally sprayed dielectric layer. The thermally sprayed dielectric layer can be formed at selected locations on the upper surface of the baseplate (,) by forming a pattern on the upper surface prior to carrying out the thermal spraying process. The electrically conductive layer (,) is patterned to form an interconnect pattern overlying the baseplate. Because the thermal spraying process can form extremely thin dielectric layers, an electronic module (,) fabricated in accordance with the invention exhibits high heat transfer characteristics. A heat producing electronic component (,), such as a power transistor, can be attached to the electrically conductive layer (,), and the heat generated therefrom dissipated through the baseplate (,).

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Hawthorn Woods, IL, United States of America

John T Meagher