Eastman-kodak Company

Corning Incorporated

Intellectual Ventures Fund 83 LLC

John T Keech

John Patrick Spence

John C Brewer

John F Sawyer

Garrett Andrew Piech

Robert Sabia

Donald O Bigelow

Aric Bruce Shorey

Michael Joseph Piatt

Paul John Shustack

John Christopher Thomas

Xinghua Li

Samuel Chen

Mark E Shafer

Eric Karl Zeise

Jeffrey John Domey

Thomas E Madden

Mark C Rzadca

Leonard Gerard Wamboldt

Jean-Francois Oudard

William Vernon Fintel

Esther M Betancourt

Leena Kumari Sahoo

Timothy Michael Gross

Shandon Dee Hart

James Joseph Price

Robert Alan Bellman

Krishnan Chari

Ronald Myron Wexler

Paul L Zengerle

Jeffrey L Hall

Eric R Schmittou

Nathan D Cahill

Jason Thomas Harris

Mark Francis Krol

Darwin Gene Enicks

Scott Christopher Pollard

Michael Lucien Genier

Thomas F Powers

Michael P Keyes

Robert A Arcus

Kristopher Allen Wieland

Ekaterina Aleksandrovna Kuksenkova

Jinlin Peng

Gary W Ahlquist

Windsor Pipes Thomas, Iii

Jeffrey Glenn Lynn

Jeffrey W Schmoeger

Elizabeth L Kelly

Jeffrey Mathew Clark

Stephen Kuo-Rui Liu

Naveen Prakash

Ronald William Davis, Jr

Erin Katherine Congdon

A glass-based assembly includes a glass substrate and a coating layer coupled to the glass substrate. Ultimate strength of the glass substrate with the coating layer overlaying and coupled thereto is greater than that of the glass substrate alone, without the coating layer.

Coating of glass-based assembly

According to one embodiment, a method for producing a coated glass article may include applying an anti-reflective coating onto a glass substrate. The glass substrate may include a first major surface, and a second major surface opposite the first major surface. The anti-reflective coating may be applied to the first major surface of the glass substrate. A substrate thickness may be measured between the first major surface and the second major surface. The glass substrate may have an aspect ratio of at least about 100:1. The coated glass article may have a reflectance of less than 2% for all wavelengths from 450 nanometers to 700 nanometers. The anti-reflective coating may include one or more layers. The cumulative layer stress of the anti-reflective coating may have an absolute value less than or equal to about 167,000 MPa nm.

Coated glass articles and processes for producing the same

In some embodiments, an ultrasonic tank includes a container, an etching solution tank comprising a working area disposed within the container, and a plurality of ultrasonic transducers arranged about a perimeter of the etching solution tank in a configuration that provides a standard deviation of ultrasonic power within the working area of less than about 0.35.

Ultrasonic tank and methods for uniform glass substrate etching

Systems and processes of cutting and drilling in a target substrate uses a laser (e.g., a pulsed laser) and an optical system to generate a line focus of the laser beam within the target substrate, such as a glass substrate sheet, are provided. The laser cutting and drilling system and process creates holes or defects that, in certain embodiments, extend the full depth of the glass sheet with each individual laser pulse, and allows the laser system to cut and separate the target substrate into any desired contour by creating a series of perforations that form a contour or desired part shape. Since a glass substrate sheet is brittle, cracking will then follow the perforated contour, allowing the glass substrate sheet to separate into any required shape defined by the perforations.

Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same

A glass wafer having a first major surface, a second major surface that is parallel to and opposite of the first major surface, a thickness between the first major surface and the second major surface, and an annular edge portion that extends from an outermost diameter of the glass wafer toward the geometrical center of the glass wafer. The glass wafer has a diameter from greater than or equal to 175 mm to less than or equal to 325 mm and a thickness of less than 0.350 mm. A width of the edge portion is less than 10 mm.

High aspect ratio glass wafer

Disclosed herein is a bottom-up electrolytic via plating method wherein a first carrier substrate and a second substrate having at least one through-via are temporarily bonded together. The method includes applying a seed layer on a surface of the first substrate, forming a surface modification layer on the seed layer or the second substrate, bonding the second substrate to the first substrate with the surface modification layer to create an assembly wherein the seed layer and the surface modification layer are disposed between the first and second substrates, applying conductive material to the through-via, removing the second substrate having the through-via containing conductive material from the assembly.

Bottom-up electrolytic via plating method

An augmented reality optical system comprises a waveguide structure that includes a waveguide layer supported by a substrate. An input grating and an output grating reside within the waveguide layer and are laterally spaced apart. Input light from a display is made incident upon the input grating. The input light is coupled into the waveguide layer and travels therein as multiple guided modes to the output grating. The input and output gratings provide phase matching so that the guided modes are coupled out of the waveguide layer by the output grating continuously along the output grating to form output light. Meantime, light from a scene is transmitted perpendicularly through the output grating so that the output light and the light from the scene are combined by the eye of a user to form an augmented reality image.

Waveguide-based optical systems and methods for augmented reality systems

A thin sheet () disposed on a carrier () via a surface modification layer () to form an article (), wherein the article may be subjected to high temperature processing, as in FEOL semiconductor processing, not outgas and have the thin sheet maintained on the carrier without separation therefrom during the processing, yet be separated therefrom upon room temperature peeling force that leaves the thinner one of the thin sheet and carrier intact. Interposers () having arrays () of vias () may be formed on the thin sheet, and devices () formed on the interposers. Alternatively, the thin sheet may be a substrate on which semiconductor circuits are formed during FEOL processing.

Carrier-bonding methods and articles for semiconductor and interposer processing

A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.

Work piece including a sacrificial cover layer for laser drilling substrates

A magnetizable glass ceramic composition including:

Magnetizable glass ceramic composition and methods thereof

Sacrificial cover layers for laser drilling substrates and methods thereof

A method for transforming an image expressed in terms of a first image encoding to a second image encoding, includes converting a set of original scene exposure-factor values into corresponding first and second image encoding values. A transform is then derived between the first image encoding values and the second image encoding values. The transform is then applied to an image encoded in said first image encoding. Examples of different encoding that can be transformed include Rec. 709, sRGB and other known image encoding standards. A system for performing such transformations as well as an electronic device that is capable of performing such transformations are also disclosed.

Method, apparatus and system for converging images encoded using different standards

A printing system includes a linehead that jets ink onto a moving print media to print a test block and an integrated imaging system positioned downstream of the linehead with respect to a media transport direction. The integrated imaging system includes an opening in a housing for receiving light reflected from a moving print media. A folded optical assembly in the housing receives the reflected light and transmits the light a distance. One or more image sensors, having known color filter arrays, within the housing each receive the light and capture one or more images of the printed test block. An image processing device is connected to the integrated imaging system for receiving pixel data from the one or more image sensors and configured to determine a color of the ink and a density of the printed test block using the pixel data.

Printhead color density correction in printing systems

A method for color density correction in a printing system that includes a linehead, with one or more printheads, that jets ink onto a moving print media and an integrated imaging system that captures images of content printed on the moving print media is provided. One or more pixel data values and a measured density value trace for a printed test block are produced by scanning the test block and averaging pixel data in a print media transport direction. A color and a density of the ink in the printed test block are determined using the pixel data values. The measured density value trace is compared with a respective reference density value. It is determined whether there is a difference between the measured density value trace and a reference density value is determined. If there is a difference, ink laydown for the printhead is adjusted based on the difference.

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Penfield, NY, United States of America

John T Keech