Schenectady Chemicals, Inc.

Performance Interconnect, Inc.

John T Keating

George A Walrath

Dau-Tsuong Lu

The present invention comprises a high performance single chip or multi-chip package which combines a CTE controlled electronic substrate, a multi-layer interconnect, bare dice or packaged devices, a top layer encapsulant and an interposer to provide a compliant and de-mountable connection to a printed circuit board. The CTE controlled electronic substrate comprises a metal or composite shell around an encapsulated core holding vertical electrical conductors. The vertical connection comprises an array of stranded or braided electrical conductors which may be exposed on the top and or bottom of the electronic substrate to provide a de-mountable interface. An interconnect layer may be attached to the planar CTE controlled electronic substrate using an adhesive or polymer. Following the connection of the interconnect to the substrate, the bare dice and/or package may be attached to the interconnect.

Apparatus for multichip packaging

A method of coating conductors with polyvinyl formal dissolved in a solvent comprising certain monoalkyl ethers of diethylene glycol and triethylene glycol or the monophenyl ether of ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol or propylene glycol. In some cases it is necessary to have a diluent such as an aromatic hydrocarbon present.

Method of coating conductors with solutions of polyvinyl acetals

Polyvinyl formal dissolved in a solvent comprising certain monoalkyl ethers of diethylene glycol and triethylene glycol or the monophenyl ether of ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol or propylene glycol. In some cases it is necessary to have a diluent such as an aromatic hydrocarbon present.

Solutions of polyvinyl acetals

Polyester-imide resins are prepared which are soluble in non-phenolic solvents by incorporating a monoether of a diethylene glycol or triethylene glycol into the resin.

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Clifton Park, NY, United States of America

John T Keating