Knowles Electronics, Inc.

Motorola Corporation

Motorola Solutions, Inc.

John Szczech

Joshua Watson

Daniel Roman Gamota

Jie Zhang

Jerzy Wielgus

Sandra Vos

Claus Erdmann Fürst

Sung Bok Lee

Tony K Lim

Venkataraman Chandrasekaran

Peter Van Kessel

Ryan McCall

Kin P Tsui

Peter V Loeppert

Julius S Gyorfi

Tomasz L Klosowiak

Swee Mean Mok

Paul W Brazis, Jr

Daniel Giesecke

Mansour Toloo

Michael Pedersen

Ke Keryn Lian

Charles William King

William A Ryan

Jose Salazar

Kurt B Friel

Hakeem B Adewole

Yu Du

Greg Servis

Gregory B Servis

Josh Watson

A method of forming a micro electro mechanical system (MEMS) assembly comprises providing a substrate having an electrically conductive layer disposed thereon. The method also comprises depositing, on the substrate over the electrically conductive layer, a bonding material having an elastic modulus of less than 500 MPa so as to form a bond layer. The bond layer is completely cured, and a MEMS die is attached to the completely cured bond layer.

MEMS assembly substrates including a bond layer

A microelectromechanical system (MEMS) transducer for integration in a microphone assembly is designed to produce heat-generated acoustic signals. The MEMS transducer generally comprises a substrate having an aperture, a transduction element located at least partially over the aperture and coupled to the substrate, electrical contacts coupled to the transduction element, and a resistor integrated with the substrate or the transduction element. The resistor is coupled to electrical contacts that are electrically isolated from the contacts of the MEMS transducer or transduction element. The transduction element includes an insulating material coupled to the substrate. The transduction element comprises a fixed electrode and a movable electrode located at least partially over the aperture of the substrate. The fixed electrode or the moving electrode is formed on the insulating material. The resistor can be formed on the insulating material or suspended from the insulating material.

MEMS microphone with integrated resistor heater

Systems and apparatuses for a microelectromechanical system (MEMS) device. The MEMS device includes a housing, a transducer, and a sensor. The housing includes a substrate defining a port and a cover. The substrate and the cover cooperatively form an internal cavity. The port fluidly couples the internal cavity to an external environment. The transducer is disposed within the internal cavity and positioned to receive acoustic energy through the port. The transducer is configured to convert the acoustic energy into an electrical signal. The sensor is disposed within the internal cavity and positioned to receive a gas through the port. The sensor is configured to facilitate detecting at least one of an offensive odor, smoke, a volatile organic compound, carbon monoxide, carbon dioxide, a nitrogen oxide, methane, and ozone.

Microphone with integrated gas sensor

A microphone includes a housing including a substrate and a cover disposed over the substrate, the housing including a sound port between the interior of the housing and the exterior of the housing. The microphone also includes a microelectromechanical systems (MEMS) transducer and an integrated circuit (IC) positioned within the housing and mounted on a common surface of the housing, where the MEMS transducer is electrically connected to the IC, and the IC is electrically connected to a conductor on the substrate. The microphone further includes an encapsulating material covering the IC, and an encapsulating material confinement structure disposed between the MEMS transducer and the IC, where the encapsulating material confinement structure at least partially confines the encapsulating material around the IC.

Microphone package

An acoustic device including a motor disposed in a housing having a non-porous elastomeric membrane disposed across an acoustic path defined by a sound port of the housing is disclosed. The motor may be embodied as MEMS transducer configured to generate an electrical signal responsive to an acoustic signal, or as some other electromechanical device. The membrane has a compliance that is 1 to 100 times a compliance of the acoustic device without the membrane, wherein the membrane prevents ingress of contaminants (e.g., solids, liquids or light) via the sound port while permitting propagation of the acoustic signal along the acoustic path without significant loss.

Acoustic assembly having an acoustically permeable membrane

A microphone includes a substrate defining an embedded cavity between a first surface of the substrate and an opposing second surface of the substrate, the first surface defining a first opening into the embedded cavity, a distance between the first surface and the second surface defining a substrate thickness. A cover is disposed over the first surface of the substrate and forms a housing, the cover including a port, the substrate thickness being greater than a height of the cover from the first surface of the substrate. A microelectromechanical systems (MEMS) transducer is disposed in the housing and mounted on the first surface of the substrate over the first opening, and an integrated circuit (IC) is disposed in the housing and electrically coupled to the MEMS transducer. The MEMS transducer and the IC are disposed in a front volume of the housing defined by the cover and the substrate.

A microphone device includes a housing including a substrate having a first surface and a cover disposed over the substrate, the housing including a sound port between the interior of the housing and the exterior of the housing. The device also includes a microelectromechanical systems (MEMS) transducer mounted on the substrate and an integrated circuit (IC) mounted on the substrate. The MEMS transducer of the device is electrically connected to the IC, and the IC of the device is electrically connected to a conductor on the substrate. An encapsulating material covers the IC. And an encapsulating material confinement structure is disposed between the MEMS transducer and the IC, wherein the encapsulating material confinement structure at least partially confines the encapsulating material around the IC.

Microphone package for fully encapsulated ASIC and wires

A microphone device comprises a microphone die including a microphone motor, an acoustic integrated circuit structured to process signals produced by the microphone motor, and a sensor die stacked on top of the acoustic integrated circuit, wherein the sensor die comprises a pressure sensor. Another microphone comprises a microphone die including a microphone motor and an integrated circuit die. The integrated circuit die comprises an acoustic integrated circuit structured to process signals produced by the microphone motor, a pressure sensor, and a pressure integrated circuit structured to press signals produced by the pressure sensor.

Microphone device with integrated pressure sensor

A microphone device comprises a microphone die including a first microphone motor and a second microphone motor, an acoustic integrated circuit structured to process signals produced by the first microphone motor and the second microphone motor, and a sensor die stacked on top of the acoustic integrated circuit, wherein the sensor die comprises a pressure sensor. Another microphone comprises a microphone die including a first microphone motor and a second microphone motor and an integrated circuit die. The integrated circuit die comprises an acoustic integrated circuit structured to process signals produced by the first microphone motor and the second microphone motor, a pressure sensor, and a pressure integrated circuit structured to press signals produced by the pressure sensor.

A microphone includes a microphone base that has a first surface and a second surface. The microphone also includes a microelectromechanical system (MEMS) device coupled to the first surface of the microphone base. The microphone also includes a cover coupled to the first surface of the microphone base, such that the cover divides the first surface into a covered portion where the cover encloses the MEMS device, and a non-covered portion extending away from the cover. The microphone also includes one or more pads on the uncovered portion of the first surface of the base. The microphone also includes a port extending through the base from the first surface to the second surface.

Top port microphone apparatus

A Microelectromechanical system (MEMS) assembly includes a substrate, lid, MEMS device, and at least one wall. The substrate has electrical connection pads and the electrical connection pads are coupled to electrical conductors extending through the substrate. The MEMS device is attached to the lid. The at least one wall is coupled to the lid and the substrate and is formed separately from the lid and has an electrical conduit disposed therein. The electrical conduit is electrically coupled to the electrical conductors on the substrate. The electrical conduit and electrical conductors form an electrical path between the MEMS device and the electrical connection pads.

MEMS apparatus disposed on assembly lid

A micro-electro-mechanical system (MEMS) microphone includes a rectangular substrate with a rigid base layer, a first metal layer, a second metal layer, one or more electrical pathways, an acoustic port, and a patterned flexible printed circuit board material. The MEMS microphone also includes a MEMS microphone die and a solid single-piece rectangular cover.

Microphone assembly with barrier to prevent contaminant infiltration

A microphone base includes a plurality of metal layers and a plurality of core layers. Each of the plurality of core layers is disposed between selected ones of the metal layers. A dielectric membrane is disposed between other selected ones of the plurality of metal layers. A port extends through the metal layers and the core layers but not through the dielectric membrane. The dielectric membrane has a compressed portion and an uncompressed portion. The uncompressed portion extends across the port and the compressed portion is in contact with the other selected ones of the metal layers. The compressed portion of the membrane is effective to operate as a passive electronic component and the uncompressed portion is effective to act as a barrier to prevent at least some external debris from traversing through the port.

Embedded dielectric as a barrier in an acoustic device and method of manufacture

A microphone includes an interposer, a lid, and a base. The interposer includes at least one wall portion that forms a cavity. The wall portion includes a first side and a second side that are opposite from each other. The lid is coupled to the first side of the interposer and the base is coupled to the second side of the interposer such that the lid and the base enclose the cavity. A microelectromechanical system (MEMS) device is disposed in the cavity. The interposer structurally supports one or both of the lid and the base. The interposer includes a plurality of plated regions that are configured to electrically connect the lid and the base. The plated regions are configured to at least partially be exposed and open to the cavity.

Interposer for MEMS-on-lid microphone

An acoustic apparatus includes a substrate, micro electro mechanical system (MEMS) die, and an integrated circuit. The substrate includes a permanent opening that extends there through. The micro electro mechanical system (MEMS) die is disposed over the permanent opening and the MEMS die includes a pierce-less diaphragm that is moved by sound energy. A first temporary opening extends through the substrate. The integrated circuit is disposed on the substrate and includes a second opening. The first temporary opening and the second opening are generally aligned. A cover that is coupled to the substrate and encloses the MEMS die and the integrated circuit. The cover and the substrate form a back volume, and the diaphragm separates the back volume from a front volume. The first temporary opening is unrestricted at a first point in time to allow gasses present in the back volume to exit through the temporary opening to the exterior and the pierce-less diaphragm prevents the gasses from passing there through. The first temporary opening is later substantially filled and closed at a second point in time, after which the acoustic device becomes operational.

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Schaumburg, IL, United States of America

John Szczech