Visa International Service Association

Sri International

John Stephens Stotts

Kenneth M Sippola

Sonia Reed

Mustafa Cemal Top

William Alexander Thaw

William B Bedwell

Steven Crouch-Baker

Francis Tanzella

Esperanza Alvarez

Subhash C Narang

Susanna C Ventura

Sunity Kumar Sharma

Mustafa Top

William Thaw

Francis Louis Tanzella

Embodiments of the invention relate to payment cards and methods for making payment cards. In one embodiment, a card comprises a first layer and a second layer adjacent to the first layer. The second layer comprises a plurality of particles comprising metal, and the plurality of particles comprise at least about 15 volume % of the second layer. In another embodiment, a mixture is prepared comprising polymer and a plurality of particles comprising metal. The plurality of particles comprise at least about 15 volume % of the mixture. The mixture is pressed and an outer layer is applied. The mixture and outer layer are then cut to form the card.

Payment card system and method

Novel compositions and methods are provided for use in the stepwise, layer by layer fabrication of three-dimensional objects, in which a build material contains a metal having a covalent bond to a non-metal, and the layers are processed to produce the three-dimensional object at least in part through a chemical reaction which alters the covalent bond of the metal. In a first aspect of the invention the build material includes a metal that is covalently bound to a polymeric precursor. In another aspect of the invention, the build material includes a metal, Me, that is covalently bound to a first ligand, L.sub.1. Following deposition of the build material, the first ligand undergoes a redox reaction with a second ligand, L.sub.2, thereby breaking the covalent bond of the metal. In more preferred embodiments of this class, L.sub.1 and L.sub.2 react to form a gas, and the metal reacts to form an oxide such as MeSO.sub.x, MeNO.sub.x, MeCO.sub.x and so forth. In yet another aspect of the invention, multiple build materials are employed to provide non-uniformities such as electrical, thermal, and magnetic conduction paths, structural supports, chemical and wear resistant areas, and so forth.

Rapid prototyping using multiple materials

Growing community of inventors

Santa Clara, CA, United States of America

John Stephens Stotts