Laird Technologies Gmbh

Littelfuse, Inc.

John Song

Paul Francis Dixon

George William Rhyne

Jason L Strader

Stephen J Whitney

Gerald Robert English

Conrado De Leon

Gordon Todd Dietsch

Mohammadali Khorrami

John Emannuel Semana

Edgardo Olan

Yoeri Ariën

Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.

Thermal management and/or EMI mitigation materials including coated fillers

In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive material is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.

Circuit assemblies and related methods

According to various aspects, exemplary embodiments are disclosed of soft and/or flexible electromagnetic interference (EMI) shields. In an exemplary embodiment, a shield is suitable for use in providing EMI shielding for one or more components on a substrate. The shield generally includes one or more contacts configured for installation on the substrate and an electrically-conductive cover configured for installation on the contact(s).

Soft and/or flexible EMI shields and related methods

In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive layer is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.

According to various aspects, exemplary embodiments include one or more frequency selective structures (e.g., two-dimensional or three-dimensional frequency selective structure or surface, etc.), which may be used for shielding or mitigating EMI within open or closed structures. Also disclosed are methods of using one or more frequency selective structures for shielding or mitigating electromagnetic interface (EMI) within open or closed structures.

Frequency selective structures for EMI mitigation

According to various aspects, exemplary embodiments include one or more frequency selective surfaces, which may be used for attenuating, reflecting, and/or redirecting electromagnetic signals. Also disclosed are methods of using one or more frequency selective surfaces for attenuating, reflecting, and/or redirecting electromagnetic signals.

Cavity resonance reduction and/or shielding structures including frequency selective surfaces

According to various aspects, exemplary embodiments are disclosed of shielding structures including one or more frequency selective surfaces, which may be used for attenuating, reflecting, and/or redirecting electromagnetic signals through open structures. Also disclosed are methods of using one or more frequency selective surfaces for attenuating, reflecting, and/or redirecting electromagnetic signals through open structures.

Shielding structures including frequency selective surfaces

A surface mount fuse in one embodiment includes an insulative body, first and second conductive and caps attached to the insulative body, each end cap defining an aperture, and a fuse element extending (i) through the insulative body and the apertures and (ii) along outside surfaces of the first and second conductive end caps in such a way that solder used to attach the first and second conductive end caps to an external medium also fastens the fuse element to the first and second end caps.

Growing community of inventors

Barrington, IL, United States of America

John Song