International Business Machines Corporation

John S Smyth

Edward W Conrad

Craig E Schneider

Daniel Boyd Sullivan

Jed Hickory Rankin

Charles Arthur Whiting

Andrew J Watts

Shawn R Goddard

William H Wagner

James C Douglas

David A Ziemer

Methods, system and program product for determining network resource availability in order to avoid time delays caused by querying unavailable resources are disclosed. In one embodiment, the invention queries the network resource to determine network resource availability and response time, and indicates the network resource is available only if the network resource is determined to be available within a specified response time.

Indicating network resource availability methods, system and program product

The invention relates to fitting a curve to a plurality of data points. A 'seed curve' is determined from a first set of data points selected from the plurality of data points. From the remaining data points, data points are individually selected and a determination is made for each selected data point as to whether the data point is acceptable to be included with the first set of data points. When a data point is determined to be acceptable, the data point is included with the first set of data points to form another set of data points. After each of the other data points are evaluated for inclusion with the first set of data points, a best fit curve is determined from a final set of data points.

System and method of curve fitting

A system and method for optimizing metrology sampling rates in an advanced process control (APC) application. A method is provided for processing a run of workpieces, the method comprising the steps of: providing a database comprising subgroups of data representing characteristics from previously processed workpieces; selecting a first subgroup of data having characteristics that satisfy a predetermined criteria; determining processing conditions for a processing tool corresponding to said first subgroup of data; processing the run of workpieces with the process tool using the determined processing conditions; and measuring the run of workpieces according to a sampling rate determined from the first subgroup of data.

System and method for optimizing metrology sampling in APC applications

A system and method for optimizing a manufacturing process. The system comprises: a database of operational data gathered from previously performed manufacturing processes; a filtering system for filtering the database into a plurality of data subsets; a calculation system for calculating evaluation criteria for a selected data subset; an analysis system for determining if the evaluation criteria meets a set of predetermined requirements; and an iteration system that selects a new data subset if the selected data subset fails to provide evaluation criteria that meets the set of predetermined requirements.

System and method for optimizing manufacturing processes using real time partitioned process capability analysis

A system and method of monitoring and predicting tool overlay settings comprise generating current lot information, generating historical data, categorizing (binning) the historical data into discrete exposure field size ranges, and predicting current lot tool overlay settings based on the current lot information and historical data. The method monitors the overlay errors during each lot pass through each lithographic process operation. Moreover, the method uses a feedback sorting criteria to monitor the tool overlay settings. Furthermore, the current lot information comprises lithographic field dimensions, wherein the lithographic field optics distortion data is derived from the current lithographic process tool. Additionally, the historical data comprises same-bin lithographic field size dimensions of previous lots, which statistically means the data is derived from the same (or similar) bin of like lots, on the current lithographic process tool.

Feedback method utilizing lithographic exposure field dimensions to predict process tool overlay settings

A method of implementing a new reticle for manufacturing semiconductors on a wafer which involves performing measurements on the reticle and assigning an initial exposure dose by using a predetermined algorithm. The exposure control system utilizes reticle CD data for automatically calculating reticle exposure offset values, i.e. reticle factors. A correlation of reticle size deviations to calculated reticle factors is used to derive a reticle factor for the new reticle. The derived reticle factor is then used to predict an initial exposure condition for the new reticle which is applied to the lithography tool for achieving a wafer design dimension.

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Milton, VT, United States of America

John S Smyth