At&t Bell Laboratories

At&t Technologies, Inc.

John S Rizzo

Jerry C Hurst

A column of flat articles such as chip carrier lids (10) are assembled in a tube (35). A base (18) supports a typical row of such lids (10), each with a back surface (14) on the base (18) and a mating surface (15) facing upward. The base (18) also has an aperture (30) for passing serially downward therethrough, each lid (10) with its back surface (14) facing downward. A bracket (32) having a spring biased pin (34) and a block (38) is provided to support under the base (18) a tube (35) with an open end facing upward at the aperture (30). Plates (22, 23 and 24) are provided to guide to and introduce a lid (10) into the aperture (30) and onto any contents within the tube (35). A frictional plug (45) has fins (46) biased between opposing walls of the tube (35) to yieldably resist downward movement within the tube (35). In a place and push operation, an upwardly biased pusher (48) has a pin (53) to urge a lid (10) and any contents in the tube (35) downward a distance sufficient to provide space for a subsequent lid (10) in aperture (30).

Assembling articles in a tube

An article such as a semiconductor wafer (12) is contacted for plating on an active surface (16). Disposed adjacent to and around the surface (16), there is a conductor such as an annular ring (58) which is adapted for connection to a current source. A composite member (62) has an outer portion (64) for contacting the conductor ring (58) and an inner portion (63) for contacting peripheral regions of surface (16) of the wafer (12). Each of the portions (64 and 63) have a substantially nonconductive matrix supporting a plurality of conductive elements having first and second ends. The first ends of the elements in the outer portion (64) are for contacting the conductor (58) and the first ends of the elements in the inner portion are for contacting the surface (16). A coupling member such as a compliant metal foil (66) is contacted to and interconnects the second ends of the elements in the inner and outer portions (63 and 64). Conductive paths are completed from conductor (58) to the surface (16) and the matrix material is compressible to seal the periphery of the wafer (12) to contain ensuing plating to the surface (16).

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Birdsboro, PA, United States of America

John S Rizzo