Lucent Technologies Inc.

Triquint Technology Holding Co.

John S Rizzo

John E Boyd

Jonathan V Haggar

Raymond Frank Gruszka

Patrick J Drummond

Gustav Edward Derkits, Jr

Ping Wu

Kenneth R Weidner

Stephanie C Marabella

Steven S Gilmore

John S Fangman

David J Zangari

John Leiby

A test fixture for testing circuit components includes at least one test bar, at least one tray, a test pedestal, a transportable test stage, a pickup collet, a first camera, and a second camera. Each test bar contains at least one circuit component. Each tray contains at least one test bar. The test pedestal is adapted to hold at least one test bar. The transportable test stage includes at least one tray and the test pedestal. The transportable test stage transports the circuit component under test from the pickup collet to the test site and return. The trays and test pedestal are in a fixed position with respect to the test stage. The pickup collet picks up test bars from the trays and the test pedestal. The pickup collet also places the test bars in the trays and on the test pedestal. The first camera is used to visually align the pickup collet and components on the test stage, and read test bar identification codes. The second camera is used to visually align the test bars with a test site.

High precision laser bar test fixture

A vacuum collet includes at least one weight disposed in the collet for assisting in removal of components from the collet. The weights are movable within the collet to gently dislodge components lodged on a bottom face of the collet. The weights may be actuated by the same vacuum which draws components to the collet.

Vacuum collet with release weights

A semiconductor chip transferring method and apparatus is described having a movable member, a flexible structure having adhesive on a lower surface thereof, a first transport assembly, and a second transport assembly. The first transport assembly is positioned beneath the support structure and includes a rotatable base upon which is mounted at least one arm. The movable member is extended into and flexes the support structure to transfer a semiconductor chip supported on a first side by the support structure to the arm which supports it on a second side. The first transport assembly moves the chip to the second transport assembly which may, in turn, move it to an output container which supports the second side. The chip has now been inverted from its initial orientation.

Apparatus and method for chip processing

A vacuum collet includes a filament disposed in the collet for assisting in removal of components from the collet. The filament is movable in a vertical direction within the collet to gently dislodge components lodged on a bottom face of the collet. The filament may be actuated by a solenoid or pneumatic or hydraulic actuator.

Vacuum collet with release filament

A laser bar loading and unloading apparatus is disclosed. The apparatus includes a mounting surface, a movable coating fixture having a plurality of spacers, and at least a first vacuum source for providing a vacuum on a laser bar mounted on the mounting surface. The spacers are movable to place a fully loaded fixture in a closed position and to place an empty fixture in an opened position. A second vacuum source directs a vacuum on a laser bar to assist in moving the laser bar into the fixture and onto one of the spacers. A third vacuum source directs a vacuum on the loaded laser bars to maintain their position in the fixture.

Automated laser bar transfer apparatus and method

A method and apparatus for preventing overspray onto bonding pads of a laser bar during facet coating includes manufacturing inserts with gaskets that are aligned with the laser bar such that the gaskets mask off the bonding pads during the facet coating process so that no overspray onto the bonding pads occurs. The gaskets are preferably made of gold with a thin titanium coating to prevent thermal compression bonding with the bonding pads. The inserts with gaskets are preferably manufactured using standard wafer processing techniques. The gaskets are preferably formed using the compliant layer metalization process described in U.S. Pat. No. 5,559,817.

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Oley, PA, United States of America

John S Rizzo