Auburn University

Auburn Research Foundation

John S Goodling

Norman V Williamson

Richard A Steadham

Richard C Jaeger

Gayner R McDaniel

A packaging and cooling structure for integrated circuit chips in electronic equipment is provided in which the chips are resiliently mounted on wafers which are centrally located in chambers within a housing. A liquid coolant is forced through orifices to spray the coolant on the wafers behind the chips and on the chips themselves providing both high velocity convective cooling and phase change boiling heat transfer. A temperature sensor and control are provided to sense and control the temperature within the electronic equipment.

Integrated circuit packaging and cooling

A poultry beak remover for debeaking fowl includes a housing having a pair of spaced apart electrodes supported therein and a beak receiving aperture therein for insertion of the beak of the fowl into the housing into proximity with the electrodes, and electrical circuitry connected with the electrodes for discharging a spark to burn the beak of the fowl and thus effect removal of a desired portion thereof.

Growing community of inventors

Auburn, AL, United States of America

John S Goodling