Micron Technology Incorporated

John S Godfrey

Tony M Teitenberg

Brian F Gordon

Gary L Chadwick

Richard Regner

A printed circuit board conveying system is provided comprising a printed circuit board conveyor and a printed circuit board support. The printed circuit board support is positioned to support a major portion of the printed circuit board between opposite lateral edge portions of the board and comprises a support base, a spacer, and a spacer securement. A printed circuit board processing system including the conveying system is also provided. The conveying system couples a printed circuit board loader to a stencil printer, a pick and place machine, and a reflow oven.

Printed circuit board support

A printed circuit board conveying and processing system. In accordance with the present invention, a printed circuit board conveying system is provided comprising a pair of conveyor rails and a printed circuit board support. The conveyor rails are positioned to engage opposite lateral edge portions of a printed circuit board along a conveyor path. The printed circuit board support is positioned to support a major portion of the printed circuit board between the lateral edge portions. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR &#xa7;1.72(b).

A printed circuit board support comprising a support base and a base extension assembly. The support base defines a support surface. The base extension assembly is secured to the support base and is arranged to define a variable extension assembly height dimension and at least a portion of a height dimension of the printed circuit board support, wherein variation of the variable extension assembly height dimension results in variation of the height dimension of the printed circuit board support. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR &#xa7;1.72(b).

A method of conveying a printed circuit board in a printed circuit board conveying system. The conveying system comprises a pair of conveyor rails and a printed circuit board support assembly. The rails are positioned to engage opposite lateral edge portions of a printed circuit board and configured to convey the printed circuit board along a conveyor path. The support assembly is positioned to support a major portion of the printed circuit board between the lateral edge portions and comprises a support base and a spacer selected from a plurality of spacers. The method comprises selecting a spacer as a function of its thickness and a thickness profile of the printed circuit board engaged by the pair of conveyor rails, installing the selected spacer by extending at least one projection into a recess, and engaging an upper spacer surface of the selected spacer with the printed circuit board. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR &#xa7;1.72().

Stencils are provided for more precisely aligning stencil orifices with terminals or &ldquo;targets&rdquo; on a substrate. One such stencil is adapted for registration with an electronic substrate, such as a PCB, about a locus. The stencil includes a stencil body and an array of printing orifices passing through the stencil body. The printing orifices may have varying sizes, with the size of each printing orifice being a function of a distance of the printing orifice from the locus. Various methods are also provided, including methods for applying solder on electronic substrates using stencils and methods and systems for designing such stencils.

Printing stencils for electronic substrates

A printed circuit board support comprising a support base, a base extension and a magnetic source. The support base defines a support surface and a lower surface. The base extension is secured to the support base and arranged to define at least a portion of a height dimension of the printed circuit board support. The magnetic source is secured to the base extension and positioned such that the lower surface of the support base is arranged to secure the printed circuit board support to an object under magnetic force. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR &sect;1.72 ( ).

A printed circuit board support, conveying system, and processing system. In accordance with the present invention, a printed circuit board support is provided comprising a support base, a spacer, and a spacer securement. The support base defines a support surface. The spacer engages the support surface. The spacer securement includes a projection and a recess. The projection adjoins one of the support base and the spacer. The recess is formed in the other of the support base and the spacer. The projection extends into the recess and the projection and the recess are configured such that the extension of the projection into the recess limits movement of the spacer relative to a plane parallel to the support surface.

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Eagle, ID, United States of America

John S Godfrey