Micrel, Incorporated

Microchip Technology Inc.

John Ryan Clark

Wan-Thai Hsu

Andrew Robert Brown

Barry Dean Wissman

Guohong He

Graham Y Mostyn

William Cochrane Ingle

Vicki L Clark

A compound spring MEMS resonator includes a resonator body constructed using one or more spring unit cells forming a compound spring block and one or more compound spring blocks forming the resonator body. Each compound spring block is anchored at nodal points to ensure a high quality factor. The resonator body further includes masses attached to the open ends of the compound spring block and capacitively coupled to drive/sense electrodes. The dimensions of the spring unit cells, the number of spring unit cells for a compound spring block, the size and weight of the masses, and the length and width of the support beams are selected to realize a desired resonant frequency. Meanwhile, the number of compound spring blocks is selected to tune the desired electrical characteristics, such as impedance, of the MEMS resonator.

Compound spring MEMS resonators for frequency and timing generation

A multiple coil spring MEMS resonator includes a center anchor and a resonator body including two or more coil springs extending in a spiral pattern from the center anchor to an outer closed ring. Each pair of coil springs originates from opposing points on the center anchor and extends in the spiral pattern to opposing points on the outer ring. The number of coil springs, the length and the width of the coil springs and the weight of the outer ring are selected to realize a desired resonant frequency.

Multiple coil spring MEMS resonator

A micromechanical device includes a substrate, a micromechanical structure supported by the substrate and configured for overtone resonant vibration relative to the substrate, and a plurality of electrodes supported by the substrate and spaced from the micromechanical structure by respective gaps. The plurality of electrodes include multiple drive electrodes configured relative to the micromechanical structure to excite the overtone resonant vibration with a differential excitation signal, or multiple sense electrodes configured relative to the micromechanical structure to generate a differential output from the overtone resonant vibration.

Vertical differential resonator

A device includes a substrate, an electrode supported by the substrate, an anchor supported by the substrate, and a composite structure supported by the anchor, disposed adjacent the electrode, and configured for resonant vibration. The composite structure includes an external layer and an internal dielectric region covered by the external layer.

Temperature compensated resonator with a pair of spaced apart internal dielectric layers

Disclosed herein are MEMS resonator device designs and fabrication techniques that provide protection against electrostatic charge imbalances. In one aspect, a MEMS resonator device includes a substrate, an electrode including a first microstructure supported by the substrate, a resonant element including a second microstructure spaced from the first microstructure by a gap for resonant displacement of the second microstructure within the gap during operation, and a disabled shunt coupled to the electrode or the resonant element. The disabled shunt is disabled to enable the resonant displacement but otherwise configured to protect against damage from an electrostatic charge imbalance before the operation of the MEMS resonator device.

ESD protection for MEMS resonator devices

Compartmented dinner service and utensil tray

A method of configuring a device comprising a MEMS resonator includes initiating operation of the device, estimating a first parameter of the MEMS resonator based on the initiated operation, the first parameter not varying with the bias voltage, monitoring the operation of the device at a plurality of levels of the bias voltage, calculating a second parameter of the MEMS resonator based on the monitored operation, the second parameter varying with the bias voltage, determining an operational level of the bias voltage based on the estimated first parameter and the calculated second parameter, and configuring the device in accordance with the determined operational level of the bias voltage.

Growing community of inventors

Howell, MI, United States of America

John Ryan Clark