Motorola Corporation

John Robert Siomkos

Edgar Herbert Callaway, Jr

Geroncio O Tan

Philip M Huang

Curtis M Griffin

A dual channel receiver (,) includes a front end bandpass filter (,) that has a front end bandwidth, a first mixer (,), a second mixer (,), and two essentially identical receiver back ends (,). The front end bandpass filter splits a received signal into a first signal (,) and a second signal (,) of essentially equal signal strengths and provides out of band isolation between first and second signal outputs (,). The first mixer is coupled to the first signal and to a high side injection signal (,), and generates a first mixer output signal (,). The second mixer is coupled to the second signal and to a low side injection signal (,), and generates a second mixer output signal (,). Each of the two essentially identical receiver back ends is coupled to one of the first and second mixer output signals.

Dual channel superheterodyne receiver

An amplifier circuit (,) uses a series transistor (,) to couple the output of an amplifier (,) to a tuned circuit load (,) and to act as a variable resistance. In one embodiment for a multi-band receiver, multiple series transistors (,) are switched for connecting different tuned circuits (,) to the amplifier's output, and an activated one of the series transistors receives a gate voltage that varies its resistance so as to achieve gain control. An activated series transistors can also provide a resistance that stabilizes the amplifier (,).

Amplifier circuit

A leadless surface mountable assembly (100) includes a heat dissipating cover (110), a substrate (120), a heat generating semiconductor device (130), and a spacer (140). The substrate (120) is mounted on the interior surface (115) of the cover (110). The heat generating semiconductor device (130) is thermally coupled to the cover (110) and electrically coupled to the substrate (120). The spacer (140) has an interface portion (147) which provides an electrical interface to the substrate (120). Electrical contacts (144) are disposed on the interface portion (147) of the spacer (140) and are electrically coupled to the substrate (120) through electrical conductors (145) within the spacer (140).

Leadless surface mountable assembly

A transmission line structure comprises a dielectric substrate (11) having first and second opposing sides separated by a first distance (3). A transmission line (13) is disposed on the first side while an opposed conductor (12) is disposed on the second side. The transmission line (13) has a first edge (4) a second edge (6), and a midde portion (8). Thicknesswise, the middle portion (8) is separated from the opposed conductor by the first distance (3), and at least a portion of the first edge (4) is separated from the opposed conductor by a second distance less than the first distance (3).

Growing community of inventors

Royal Palm Beach, FL, United States of America

John Robert Siomkos