Harris Corporation

Harris Global Communications, Inc.

John Robert McIntyre

John Paul Shoots

Kevin Dell

Christopher David Mackey

Andrew Mui

Anthony Clement Manicone

Andrew J Eller

Gary Anton Schwenck

Timothy W Burks

An RF device may include RF circuitry having a PIN diode configured to switch an RF signal, and a biasing circuit. The biasing circuit may include a controllable power supply having a control input and an current output coupled to the PIN diode to selectively bias the PIN diode into an ON state, and a feedback circuit coupled between the current output and the control input of the controllable power supply to set a current delivered to the PIN diode in the ON state.

RF device with biasing circuit for PIN diode and related methods

An electronic device may include a housing, a first printed circuit board (PCB) carried by the housing and radio frequency (RF) circuitry on the PCB, and an RF filter module carried by the PCB. The RF filter module may include a second PCB carried by the first PCB, a plurality of first coaxial resonators arranged in side-by-side relation on the second PCB, and at least one second coaxial resonator stacked on the plurality of first coaxial resonators, and interconnect circuitry coupling the plurality of first coaxial resonators and the at least one second coaxial resonator to the second PCB.

Electronic device including radio frequency (RF) filter module with stacked coaxial resonators and related methods

An electronic device may include a circuit board, an IC carried by the circuit board, and an RF shield above the IC. The circuit board may include a dielectric layer, and a thermally conductive body in the dielectric layer. The thermally conductive body may have a first heat transfer surface coupled to the IC. The thermally conductive body may extend laterally within the dielectric layer and outward past the RF shield and defining a second heat transfer surface. The electronic device may include a heat sink coupled to the second heat transfer surface.

Electronic device with laterally extending thermally conductive body and related methods

Wireless transceiver includes a plurality of RF filters. A first band switching network includes a first plurality of RF switches to selectively direct transmitter RF energy to a selected RF filter. A second band switching network includes a second plurality of RF switches which selectively controls which of RF filter is connected to an antenna port. A receiver RF switch is connected to at least one of the RF filters and to a receiver input to selectively permit the received RF energy arriving at one RF filter to be communicated to the receiver. Each RF switch is a PIN diode type with at least one series diode provided along a signal path. No more than two PIN diodes are present in the signal path between the common transmitter port and the common antenna port when any of the RF filters is in use.

Power saving transceiver switch configuration

An RF communications device may include a circuit board having a dielectric layer and conductive traces, one of the conductive traces defining a transmission line. The RF communications device may also include an RF transmitter carried by the circuit board and coupled to the transmission line, and RF switching circuits, each RF switching circuit including a substrate having a tapered proximal end coupled to the transmission line, and a distal end extending outwardly on the convex side of the transmission line. Each RF switching circuit may include a series diode, and a shunt diode coupled to the series diode, the series diode extending from the tapered proximal end and across an interior of the substrate.

RF communications device with conductive trace and related switching circuits and methods

A communications device may include a power amplifier having an input and an output, and a direct current (DC) feed network. The DC feed network may include a radio frequency (RF) transmission line stub having a first end coupled to the output of the power amplifier and a second end coupled to a DC feed voltage, and at least one RF shorting switch coupled between a corresponding location along the RF transmission line stub and a voltage reference. The communications device may further include a controller configured to selectively operate the at least one RF shorting switch to set an operating frequency band of the power amplifier.

Electronic device with RF transmission line stub and RF shorting switch configuration and related methods

A switching circuit may include a first series diode, a second series diode, a first shunt diode coupled to the first series diode at a first control node, and a second shunt diode coupled to the second series diode at a second control node. A high voltage supply may generate a high voltage signal to be selectively applied to either the first or second control node. A dc-dc converter may cooperate with the high voltage supply to generate an intermediate bias voltage on the first and second shunt diodes so that the first series diode is reversed biased and the first shunt diode is forward biased when the high voltage control signal is applied to the first control node, and so that the second series diode is reversed biased and the second shunt diode is forward biased when the high voltage control signal is applied to the second control node.

Switching circuit including DC-DC converter cooperating with a high voltage supply and related methods

An electronic device may include a transistor device including a transistor package and transistor terminals extending outwardly therefrom. The electronic device may also include an electrically conductive body removably coupled to and shorting together the transistor terminals for electrostatic discharge (ESD) protection.

Electronic device including electrically conductive body for ESD protection and related methods

An electronic device may include a printed circuit board (PCB) including a ground plane and having first and second opposing surfaces. The electronic device may also include a radio frequency (RF) directional coupler carried by the first surface of the PCB and including a housing and circuitry therein defining an input port, an output port, and first and second monitoring ports. A first monitoring circuit may be carried by the first surface of the PCB and connected to the first monitoring port. The electronic device may also include a via conductor connected to the second monitoring port and extending through the PCB to the second surface thereof. A second monitoring circuit may also be carried by the second surface of the PCB and connected to the via conductor.

Growing community of inventors

Rochester, NY, United States of America

John Robert McIntyre