Hewlett Packard Enterprise Development LP

Hewlett-packard Development Company, L.P.

Compaq Information Technologies Group, L.p.

John Robert Grady

Kevin B Leigh

George D Megason

Joseph R Allen

Troy Anthony Della Fiora

John P Franz

Belgie B McClelland

Keith A Sauer

David F Bolognia

Kevin F Labbe

Everett R Salinas

Yinggang Du

Andrew Potter

Sunil Rao Ganta Papa Rao Bala

Ray G Basinger

Keith J Kuehn

Harvey John Lunsman

Montgomery C McGraw

David W Sherrod

James Jeffery Schulze

Mitchel E Wright

Chong Sin Tan

Daniel W Tower

Sunil Ganta

Jeffery Michael Giardina

Carl D Massey

Arthur G Volkmann

Rachid Kadri

Hsin Chang Lu

Gregory L Gibson

Kai Zhang

Sung-Hsia Kuo

David S Blocker

Ching-Chun Hsu

Wanda L Bloomfield

Billy E Buller, Jr

Aaron M Albaugh

George David Megason

A hybrid drive carrier frame includes a front rail comprising a first end, a second end, and a body extending along a transverse direction between the first and second ends. The frame comprises a first side rail extending from the first end of the front rail perpendicular to the transverse direction and a second side rail extending from the second end of the front rail perpendicular to the transverse direction and parallel to the first side rail. The first side rail is formed from a metal material and includes a locking tab extending along the transverse direction. The front and second side rails are formed from a plastic material. The front rail includes a locking channel at the first end of the front rail and the first side rail is connected to the first end of the front rail via engagement of the locking tab within the locking channel.

Hybrid drive carrier frame

An electronic device includes a chassis, electronic components disposed within the chassis, cooling containers, and a coolant loop. The chassis has an internal volume partly filled with coolant to form coolant pool in the internal volume. The containers are disposed within the chassis such that each container contains at least one electronic component. The coolant loop circulates the coolant from the coolant pool to the containers. For example, each container receives an inflow of the coolant from the coolant loop or from another one container and immerse the at least one electronic component in the coolant to remove heat from the at least one electronic component and output an outflow of the coolant that overflows into the coolant pool or into at least one adjacent container, where a level of the coolant in the coolant pool is lower than respective levels of the coolant in the containers.

Immersion cooling using cooling containers for an electronic device

A light pipe housing for a drive carrier comprises a base structure having a front face, a back face, a first light pipe cavity, and a second light pipe cavity. The light pipe housing comprises a raised ramp extending between the first light pipe cavity and the second light pipe cavity, the raised ramp having a first edge adjacent to the first light pipe cavity and a second edge adjacent to the second light pipe cavity. The housing further comprises a top cover having a cut out portion. The base structure and top cover are in conjunction configured to carry any one of a first light pipe and a second light pipe for the drive carrier. The light pipe housing configured to carry one light pipe at a time. The first light pipe and the second light pipe have mutually different light pipe arrangements.

Adaptable housing for light pipes with different light pipe arrangements

A drive blank comprises a front member having a first end, a second end, a back face, and an aperture formed between the first end and the second end. The drive blank further has a first side member and a second side member each extending perpendicularly from the first end and the second end of the front member, respectively. The drive blank has a rear member extending parallel to the front member and between the first and second side members. A locking element is formed integral to the front member. The locking element comprises a looping portion having a first end and a second end and a push button formed at the second end of the looping portion and disposed in the aperture. The push button has a locking catch, releasably coupled to a latch element of a handle, to lock the handle in a closed position.

Integrated locking mechanism for drive blanks

A drive adaptor has an adaptor volume defined between a front wall, a rear wall, a first side wall, and a second side wall. The drive adaptor further includes a third side wall and a fourth side wall disposed between the first and second side walls and connected to the front and rear walls to define a drive compartment within a portion of the adaptor volume. Each of the third and fourth side walls includes one or more retention elements. The drive compartment receives a first form factor drive and the one or more retention elements retains the first form factor drive in the drive compartment. The drive adaptor is received in a drive carrier volume of a drive carrier, where a width of the drive carrier volume conform to a width of a second form factor drive, which is greater than a width of the first form factor drive.

Drive adaptor for a drive carrier

A drive carrier comprises a front portion, a first lateral rail extending from the front portion, and a second lateral rail extending from the front portion. The front portion and first and second lateral rails form a frame configured to receive a media drive between the first and second lateral rails. The first lateral rail is formed from plastic and comprises a screw hole. When the media drive is received in the frame, the media drive is coupled to the first lateral rail by a screw inserted through the screw hole. The drive carrier also has a metal screw plate in-molded into the plastic of the first lateral rail surrounding the screw hole. The screw plate strengthens the first lateral rail around the rim of the screw hole to prevent the head of the screw from cracking the plastic and/or tearing through the plastic.

Drive carrier with in-molded screw plate

Drive blank

An air baffle assembly for air cooling in computer systems is described. The air baffle assembly can include a baffle body removably installed on a printed circuit assembly deployed on a chassis. The baffle body can cover memory components. The air baffle assembly can also include an air dam removably installed on the baffle body. The baffle body has a slot positioned on a side of the baffle body, which can be substantially parallel to a wall of the chassis. The baffle body can further include alignment rails positioned in the slot to guide installation of the air dam into the slot. The installed air dam can reduce a bypass region, thereby reducing airflow through the bypass region and increasing airflow through the memory components.

Removable air dams for air cooling in computer systems

A computing system includes an array of compute module racks, each compute module rack containing a plurality of compute modules and each compute module being accessible by extracting the compute module rack out of the array of compute module racks. A liquid distribution infrastructure comprising liquid coolant supply lines and return lines is arranged in a first plane adjacent to the array of compute module racks and coupled to each of the vertical racks to provide liquid cooling for the plurality of compute module racks. A power distribution infrastructure comprising power supply lines is arranged in a second plane adjacent to the array of compute module racks and coupled to each of the compute module racks. An optical interconnection infrastructure comprising optical fiber cables is arranged in a third plane adjacent to the array of compute module racks and coupled to each of the compute module racks.

Contiguous plane infrastructure for computing systems

A lock mechanism for a faceplane infrastructure coupled externally from a faceplate of a modular device includes a locking bar, a locking bar engagement element, and a securing device. When the lock mechanism is assembled and in a locked state, the locking bar is housed within the modular device. Further, when the lock mechanism is assembled and in the locked state, the locking bar engagement element is fixedly coupled to a first portion of the faceplane infrastructure and removably engaged with the locking bar through an aperture in the faceplate of the modular device. Moreover, when the lock mechanism is assembled and in the locked state, the securing device locks the first portion of the faceplane infrastructure to the faceplate of the modular device.

Lock for faceplane infrastructure

A computing device, comprising: a chassis; an optical base layer, including optical connectors; a power base layer, including power connectors; a thermal base layer, including a cold supply line with liquid disconnects, hot return lines with liquid disconnects, and thermal infrastructure interfaces; a radio frequency base layer, including radio frequency connectors; a power interface, wherein the power interface connects to the power base layer; a power supply to connect to the power interface and provide power to the power base layer through the power interface; and bays defined by bay divider walls, wherein each bay divider wall is removable and each bay comprises one of the optical connectors, one of the power connectors, one liquid disconnect for the supply line, one of the liquid disconnects for a hot return line, and one of the radio frequency connectors.

Computing device

An optical midplane includes an airframe having a first side on which first modules are disposed and a second side on which second modules are disposed. The airframe is to provide for optimized airflow through the first modules disposed on the first side. A plurality of optical connectors are disposed at respective locations on the airframe to provide optical connectivity. Optical connectivity is provided between at least one of any first module disposed on the first side of the airframe and any second module disposed on the second side of the airframe, any first modules disposed on the first side of the airframe, and any second modules disposed on the second side of the airframe.

Airframe-integrated optical midplane

Systems and assemblies are provided for reconfigurable waveguide (RWG) blocks having fixed waveguides therein. The RWG blocks can receive multiple self-aligned simplex ferrules to achieve customized fiber shuffles that are reconfigurable. A RWG block assembly includes the RWG block with fixed waveguides, a parallel-fiber ferrule interface to install a parallel-fiber ferrule, a plurality of simplex ferrule interfaces to install one or more simplex ferrules which allows the simplex ferrules to be positioned modularly within the RWG block assembly. The fixed waveguides allow optically coupling between the parallel-fiber ferrule and the one or more simplex ferrules via the RWG block. An assembly can also include a RWG block housing with the RWG block installed therein, and a carrier bracket coupled to the RWG block housing that receives a plurality of simplex ferrules such that each of the plurality of simplex ferrules can be positioned modularly and self-aligned within the carrier bracket.

Reconfigurable fix-shuffled waveguides with modular simplex ferrules

Examples described herein include an assembly. The assembly may be a heatsink assembly or some other cooling assembly (for example, a liquid cooling assembly). The heatsink or cooling assembly may include a heatsink or some other cooling means, such as a liquid cooling device. The heatsink or cooling assembly may include a base. The heatsink itself may connect to a base or the bottom of the heatsink may form the base. The base may interface or connect to a bolster plate. The base may interface or connect to a bolster plate via apertures in the base and fasteners included on the base and the bolster plate. The heatsink or cooling assembly may include one or more apertures to accept one or more guide pins and/or retention pins on the bolster plate. The base may include retention mechanisms positioned over the apertures to attach to retention pins on the bolster plate. The retention pins may be the guide pins with retention features.

Heatsink with retention mechanisms

An example frame shuffle is communicatively coupled to a midplane of a frame. The frame shuffle includes a first group of optical connectors. Each of which are communicatively coupled to a resource device via the midplane. The frame shuffle also includes a second group of optical connectors, each of which communicatively couples with a frame shuffle of an adjacent frame. The frame shuffle also includes a routing device to optically interconnect the resource devices and another group of resource devices of the adjacent frame. The frame shuffle also includes a frame shuffle fan to provide fresh air through the frame shuffle and direct exhaust air through the midplane.

Interconnected modular server and cooling means

Growing community of inventors

Houston, TX, United States of America

John Robert Grady