International Business Machines Corporation

Globalfoundries Inc.

Mentor Graphics Corporation

John Robert Goss

Robert J McMahon

Michael Richard Ouellette

Paul J Grzymkowski

Igor Arsovski

Nazmul Habib

Eric D Hunt-Schroeder

Michael Anthony Ziegerhofer

Jeanne P Bickford

Krishnendu Mondal

Aravindan J Busi

Kiran K Narayan

Andrew K Killorin

Darren Lane Anand

Donald Lawrence Wheater

Thomas Gregory Sopchak

Troy Joseph Perry

Jeanne Paulette Spence Bickford

Peter O Jakobsen

John Atkinson Fifield

Kevin William Gorman

Thomas O Sopchak

Peter O Jacobsen

A BIST engine configured to store a per pattern based fail status during memory BIST run and related processes thereof are provided. The method includes testing a plurality of patterns in at least one memory device and determining which of the plurality of patterns has detected a fail during execution of each pattern. The method further includes storing a per pattern based fail status of each of the detected failed patterns.

Built-in self-test (BIST) engine configured to store a per pattern based fail status in a pattern mask register

Systems and methods are provided for implementing customer-transparent logic redundancy in scan chains for improved yield of integrated circuits. More specifically, an integrated circuit structure is provided for that includes a plurality of combined latch structures. Each of the combined latch structures includes an original latch and a redundant latch. The integrated circuit structure further includes a plurality of combined logic structures. Each of the combined logic structures includes an original logic structure a redundant logic structure. Each redundant latch is a duplicate of each respective original latch within a combined latch structure and each redundant logic structure is a duplicate of each respective original logic structure within a combined logic structure such that a two-fold library of latches and logic is provided for one or more scan chains of the integrated circuit structure.

Customer-transparent logic redundancy for improved yield

Built-in-self-test (BIST) engine configured to store a per pattern based fail status in a pattern mask register

Various embodiments include approaches for analyzing a customer design for an application specific integrated circuit (ASIC). In some cases, an approach includes: determining performance requirements of the customer design; querying a test screen database for the performance requirements of the customer design, the test screen database having failure thresholds and associated test screens for detecting the failure thresholds for a set of ASIC devices; generating a filter database including select failure thresholds and associated test screens for the performance requirements of the customer design; and selecting a set of test screens from the filter database based upon a yield cost criteria in forming the ASIC.

Application specific integrated circuit (ASIC) test screens and selection of such screens

Disclosed are methods for performing threshold voltage (VT)-type transistor sensitive and/or fan-out sensitive selective voltage binning (SVB) to improve SVB accuracy and, thereby product yield and reliability. In the methods, a process distribution for an integrated circuit chip design is divided into process windows, each associated with a corresponding performance range and a corresponding minimum supply voltage. First performance measurements are acquired from first performance monitors associated with first transistors on chips manufactured according to the design. Based on the first performance measurements, the chips are assigned to groups corresponding to the process windows. Second performance measurements are also be acquired from second performance monitors associated with second transistors, which are on the chips and which have either a different VT-type or a different maximum fan-out than the first transistors. Based on the second performance measurements, a determination is made as to whether chip group reassignment is warranted.

Threshold voltage (VT)-type transistor sensitive and/or fan-out sensitive selective voltage binning

Systems and methods are provided for implementing customer-transparent logic redundancy in scan chains for improved yield of integrated circuits. More specifically, an integrated circuit structure is provided for that includes a plurality of combined latch structures. Each of the combined latch structures includes an original latch and a redundant latch. The integrated circuit structure further includes a plurality of combined logic structures. Each of the combined logic structures includes an original logic structure a redundant logic structure. Each redundant latch is a duplicate of each respective original latch within a combined latch structure and each redundant logic structure is a duplicate of each respective original logic structure within a combined logic structure such that a two fold library of latches and logic is provided for one or more scan chains of the integrated circuit structure.

An integrated circuit device includes component devices (that include primary and alternate devices) and storage elements connected to the component devices. The storage elements store different sets of repair addresses indicating which of the primary devices and alternate devices are to be enabled. Further, a controller is connected to the storage elements, and a temperature sensor is connected to the controller. The temperature sensor senses the temperature. The controller selects one of the different storage elements to select at least one of the sets of repair addresses based on the temperature sensed by the temperature sensor. The sets of repair addresses share use of at least one of the alternate devices and at least one of the primary devices.

Thermally adaptive in-system allocation

A method of reliability evaluation and system fail warning using on chip parametric monitors. The method includes determining impact of parametric variation on reliability by identifying key parametric questions to be answered by stress, identifying parametric macros for each parameter, and identifying layout sensitive areas of evaluation. The process can also include a set of parametric macros in one of a test site or a product to be stressed, testing the set of parametric macros prior to start of stress and at each stress read out, and setting life time parameter profile for technology.

Reliability evaluation and system fail warning methods using on chip parametric monitors

The present invention relates to a method and circuit for selectively repairing an embedded memory module having memory elements in an integrated circuit chip. The method includes performing a plurality of tests on the embedded memory module under operating conditions to identify a plurality of non-operational memory elements in the embedded memory module and, in response to identifying the non-operational memory elements, generating a plurality of corresponding repair solutions. The method further includes storing the plurality of corresponding repair solutions in a non-volatile storage element and determining from a mask a subset of the plurality of repair solutions that should be restored.

Selectable repair pass masking

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South Burlington, VT, United States of America

John Robert Goss