General Electric Company

Other

Sabic Innovative Plastics IP B.v.

Momentive Performance Materials Gmbh

Ge Plastics Japan Ltd.

John Robert Campbell

Timothy J Shea

Gary William Yeager

Kenneth Paul Zarnoch

Michael Alan Vallance

Prameela Susarla

Farid Fouad Khouri

John Austin Rude

Sterling B Brown

James Ross Fishburn

Robert E Williams, Jr

Neal Steven Falcone

Johannes Martinus Dina Goossens

Hendrik Verhoogt

Richard Lucas

Luc Carlos Govaerts

John Jeffrey Talley

Hua Guo

Slawomir Rubinsztajn

Amy Rene Freshour

Sandeep Shrikant Tonapi

Bryan Duffey

Ananth Prabhakumar

James Anthony Cella

Tohru Takekoshi

George R Loucks

Ryan Christopher Mills

Thomas Miebach

Marinus E Dekkers

Howard J Klopfer

Kevin Hsingtao Dai

Luc Govaerts

Therese C Jordan

Robert A Florence

Andra J Moffett

Matthew Ladd Reitz

James W Thackeray

Jos Herman Peter Bastiaens

Victor Mark

Larry Neil Lewis

Gary Charles Davis

Michael Joseph O'Brien

Dwain M White

Thomas L Evans

Sai-Pei Ting

Gregory Ronald Gillette

Adeyinka Adedeji

Robert J Axelrod

Luca P Fontana

Steven Thomas Rice

Kenneth G Powell

Gary R Faler

William David Richards

James J Scobbo, Jr

Paul Edward Howson

Stanley Young Hobbs

Thomas Arnold Ebeling

John Bennie Yates, Iii

Chorng-Fure Robin Hwang

Glen David Merfeld

John E Kochanowski

Joseph John Caringi

Robert J Halley

Laura A Socha

Nirajkumar Chaturbhai Patel

James R Presley

Robert H Wildi

Jerry C Lynch

Jack A Hill

Walter Van Der Heijden

Monica M Marugan

Greg R Bradtke

Paul M Conroy

Patrick A Rodgers

Carol B Wasserman

Linda McAdam Gemmell

Vinod Kumar Berry

Jack Lew Little

Catherine Marie Pottier-Metz

Patric A Rodgers

Padmavathy Rajagopalan

Egidius Hubertus Johannes Van Der Veeken

Philip C Johnson

Jian Zhang

Stephen Andrew Latham

A thermoset composition exhibiting reduced water absorption in the cured state includes an olefinically unsaturated monomer and a capped poly(arylene ether) prepared by the reaction of an uncapped poly(arylene ether) with an anhydride capping agent. The capped poly(arylene ether) is isolated and/or purified by methods that reduce the concentrations of polar impurities that contribute to water absorption by the cured composition.

Capped poly(arylene ether) composition and process

A cure catalyst is provided. The cure catalyst may include a Lewis acid and one or both of a nitrogen-containing molecule or a non-tertiary phosphine. The nitrogen-containing molecule may include a mono amine or a heterocyclic aromatic organic compound. A curable composition may include the cure catalyst. An electronic device may include the curable composition. Methods associated with the foregoing are provided also.

Cure catalyst, composition, electronic device and associated method

An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionalized polymer and at least one reactive monomer composition. The reactive monomer composition may include a reactive monomer component that may be a low temperature solid and may be present in an amount in the reactive monomer composition a range of greater than about 20 weight percent based on the total weight of reactive monomer composition. The mixture, at about low temperature, may be solid or tack-free, or both solid and tack-free.

Curable encapsulant composition, device including same, and associated method

An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized colloidal silica filler having a particle size ranging from about 1 nm to about 500 nm. The difunctional siloxane anhydride epoxy hardener can optionally be combined with liquid anhydride epoxy hardeners. Cure catalysts, hydroxyl-containing monomers, adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.

Underfill composition and packaged solid state device

A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a phosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.

Flame-retardant thermoset composition, method, and article

A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a metallophosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.

A curable composition includes a functionalized poly(arylene ether), an olefinically unsaturated monomer, about 0.2 to about 5 parts by weight of a curing initiator per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer, and about 0.005 to about 1 part by weight of a curing inhibitor per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer. The weight ratio of the curing initiator to the curing inhibitor is about 1.2:1 to about 50:1. The composition provides improved and reproducible flow during the early stages of molding without compromising curing time. The composition is useful for preparing plastic-packaged electronic devices.

Poly (arylene ether) composition and method

A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof, thereby forming a solvent-modified resin. The second curable fluxing composition includes at least one epoxy resin. The combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.

Combinations of resin compositions and methods of use thereof

Disclosed are flame retardant resinous compositions comprising (i) at least one aromatic polycarbonate, (ii) at least one a rubber modified graft copolymer, (iii) at least one silyl borate ester, (iv) at least one organophosphorus compound, and (v) at least one fluoropolymer additive. The compositions exhibit improved surface properties in molded parts.

Flame retardant resinous compositions and method

Disclosed are flame retardant resinous compositions comprising (i) at least one aromatic polycarbonate; (ii) at least one of a second polymer having structural units derived from one or more monomers selected from the group consisting of vinyl aromatic monomers, monoethylenically unsaturated nitrile monomers, and C -C alkyl (meth)acrylate monomers; (iii) at least one rubber modified graft copolymer; (iv) at least one polymeric or non-polymeric organic phosphorus species; (v) at least one antidrip agent; and (vi) at least one perfluoroalkanesulfonate salt present in an amount in a range between about 0.01 wt % and about 0.25 wt %, based on the weight of the entire composition. Also disclosed are methods for making said compositions.

The present invention relates to a method for preparing phosphoramides having a glass transition temperature in one embodiment of at least about 0&deg; C., in another embodiment of at least about 10&deg; C., and in still another embodiment of at least about 20&deg; C., the phosphoramides being substantially free of acidic, basic, or halide impurities, or their precursors. The invention also relates to resin compositions comprising at least one thermoplastic resin and at least one phosphoramide having a glass transition temperature of at least about 0&deg; C., wherein the phosphoramide is prepared by the method of the invention.

Method to prepare phosphoramides, and resin compositions containing them

The barbeque fork includes a first tine and a second tine. Each of the tines has a first end, a second, a top side, a bottom side, an inner side edge and an outer side edge. The inner side edges and outer side edges tapering from the first end to the second end such that the second ends are pointed. A plate has a top surface, a bottom surface, a front edge, a first side edge and a second side edge. Each of the first ends is integrally coupled to the front edge such that the tines extend in a generally parallel direction with respect to each other. A shank has a first end integrally coupled to the back edge of the plate such that the shank extends away from the plate. A third tine has a first end, a second end, and a pair of side edges tapering toward each other from the first end to the second end. The first end of the third tine is integrally coupled to the outer edge of the first tine and located generally adjacent to the plate.

Barbeque fork

A flame retardant polycarbonate composition includes (A) at least one polycarbonate and (B) a silsesquioxane flame retardant. The flame retardant polycarbonate composition can be made by providing a polycarbonate and incorporating a flame retardant amount of a silsesquioxane into the polycarbonate. An article can be molded from the composition.

Flame retardant polycarbonate-silsesquioxane compositions, method for making and articles made thereby

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Clifton Park, NY, United States of America

John Robert Campbell