Mentor Graphics Corporation

Siemens Industry Software Gmbh

John Richard Wilson

Robin Bornoff

John Parry

Aspects of the disclosed technology relate to techniques of improving heat sink designs based on systematic mass removal. A thermal simulation is performed to determine thermal property values for a heat sink design. The thermal property value of a portion of the heat sink design relates to the portion's contribution to thermal performance of the heat sink design. One or more portions of the heat sink design are selected based on the thermal property values and removed to generate a new heat sink design. The performing operation and the removing operation are repeated until one of one or more predetermined conditions is met.

Subtractive design for heat sink improvement

Various aspects of a technology disclosed herein relate to thermal model obfuscation. A thermal model for a first assembly is received. An obfuscated thermal model is then generated from the thermal model. The generation comprises replacing name or names associated with one or more objects in the first assembly with obfuscated names. The obfuscated thermal model can be used in a thermal simulation of a second assembly, of which the first assembly is a component.

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Sunnyvale, CA, United States of America

John Richard Wilson