International Business Machines Corporation

John Rasile

Peter Bakos

Irving Memis

Joseph G Ameen

Nelson P Franchak

Dennis L Rivenburgh

Ronald Walker Gedney

Oscar R Abolafia

David W Hume, Jr

A neutralization process is provided for neutralizing chloride ions in etched via holes in multilayer printed circuit boards. The process comprises two dip operations of the board in a Neutra-Clean and water solution which is continuously re-circulated. This is followed by subjecting the board to a heated de-ionized cascaded water feed, an ambient overflow de-ionized water rinse, and conveyorized air drying. The Neutra-Clean solution has the ability to penetrate down to the bottom of the via hole and to attract the free chloride ions from the etchant residue. The de-ionized water feed and rinse steps rinse out and remove the Neutra-Clean solution and any residuals formed by chemical reaction.

Neutralizing chloride ions in via holes in multilayer printed circuit

A method for reducing the concentration of carbonate in an aqueous solution which includes contacting the aqueous solution with a strongly basic ion-exchange resin.

Reducing carbonate concentration in aqueous solution

Chromium/copper/chromium conductor lines and glass-chromium cermet resistor structures are formed on a substrate by a subtractive etch process in which undercutting of the top chromium layer and changes in the resistivity of the cermet are minimized by etching the chromium with a mixture of a low concentration (about 5 to 20% by volume) of concentrated (37%) HCl in about 65 to 95% by volume of an aliphatic alcohol such as glycerine with the remainder, if any, to make 100% being water at an elevated temperature of from about 50.degree. to 95.degree. C.

Etch process for chromium

A ceramic substrate is provided with via holes and these holes are primed by first depositing a palladium coating to the inside surface of the holes and then depositing an iron film onto the palladium. The primed holes are then completely filled with copper to provide conductive connections between opposite surfaces of the substrate. On one side of the substrate, input/output connector pins are brazed to the copper fillings. On the other side, printed circuitry is applied to produce a circuit module.

Method of making metal filled via holes in ceramic circuit boards

A prepunched copper/dielectric laminate ground plane assembly is positioned on a metallized ceramic substrate having printed circuits on the surface thereof and provided with a plurality of circuit connection pins. Connection between the ground plane and the circuit connection pins is achieved by welding or soldering of bonding elements between selected pins, which also provides mechanical attachment of the ground plane to the substrate.

Integrated circuit package

A hermetic topsealant for metal electrodes on components and other microelectronic circuitry is formed by polymerizing a mixture of an unsaturated silane monomer, a bifunctional silane adhesion promoter, a polymeric plasticizer and a stabilizer. The purpose of this abstract is to enable the public and the Patent Office to rapidly determine the subject matter of the technical disclosure of the application. This abstract is neither intended to define the invention of the application nor is it intended to be limiting as to the scope thereof.

Hermetic topsealant coating and process for its formation

A positive photoresist having increased sensitivity to light and formed by the addition of an acidic compound to a 1,2-quinone-diazide sulphonic acid ester sensitizer.

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Endicott, NY, United States of America

John Rasile