Agilent Technologies, Inc.

Ford Motor Company Limited

Keysight Technologies, Inc.

John Ralph Lindsey

Marvin Glenn Wong

Lewis R Dove

You Kondoh

Paul E Stevenson

David J Dascher

Paul Thomas Carson

John Carlson Ames

Judd Steven Carper

William John Boardman

John Crumlin

A method of forming a connection receptacle over a substrate includes printing a first dielectric layer over the substrate between first and second transmission lines, the first dielectric layer having a tapered cross-section along a plane extending from the first transmission line to the second transmission line; disposing a conductive layer over the printed first dielectric layer; and electrically connecting the conductive layer to a conductor of the first transmission line and a conductor of the second transmission line.

Method for building a connection between a coaxial RF cable and hybrid package using 3D printing and a connection receptacle

In one embodiment, a switch includes first and second mated substrates defining therebetween a number of cavities. A plurality of wettable elements are exposed within one or more of the cavities. A switching fluid is held within one or more of the cavities. The switching fluid serves to connect and disconnect at least a pair of the plurality of wettable elements in response to forces that are applied to the switching fluid. A gas is also held within one or more of the cavities. The gas is provided to react with oxides on or in the cavities. An actuating fluid is held within one or more of the cavities and applies the forces to the switching fluid. Methods of making such a switch are also disclosed.

Reduction of oxides in a fluid-based switch

A switch includes a switching element, a substrate, a lid and a thickfilm dielectric. The substrate has a plurality of signal conductors formed thereon, at least some of which are in contact with the switching element. The lid covers the switching element and has a perimeter that intersects at least some of the signal conductors. The thickfilm dielectric is printed on the substrate below the perimeter of the lid, and the lid is mounted on the thickfilm dielectric.

Switch, with lid mounted on a thickfilm dielectric

Fluid-based switch and methods for reducing oxides on switching fluid are disclosed. In one method, oxides are reduced by depositing a switching fluid on a first substrate, mating the first substrate to a second substrate, the first substrate and the second substrate defining therebetween a cavity holding the switching fluid, the cavity being sized to allow movement of the switching fluid between first and second states, and creating a gas in the cavity holding the switching fluid, the gas to react with at least one of oxygen in the cavity and oxides on the switching fluid.

Reducing oxides on a switching fluid in a fluid-based switch

A fluid-based switch and method for producing the same are disclosed. In one embodiment, the switch is produced by depositing switching fluid on a first substrate; depositing a reducing material so that the reducing material contacts at least a portion of the switching fluid, the reducing material to react with oxides on the switching fluid, and mating a first substrate to a second substrate, the first substrate and the second substrate defining therebetween a cavity holding the switching fluid, the cavity being sized to allow movement of the switching fluid between first and second states.

A first resist is deposited on at least a portion of a substrate (or existing feature on the substrate) that will underlie a feature in a nonphotoimagable material that is to be deposited on the substrate. Thereafter, the nonphotoimagable material is deposited so that it overlaps at least a portion of the first resist. A second resist is then deposited on at least a portion of the nonphotoimagable material, and a feature is patterned on the second resist. Subsequently, the part is sandblasted until the first resist is exposed, and the first and second resists are then removed. In one embodiment, the nonphotoimagable material is deposited on a channel plate and used to seal at least a switching fluid between the channel plate and another substrate.

Feature formation in a nonphotoimagable material and switch incorporating same

Resonance within an attenuator relay caused by stray coupling capacitances to, and stray reactance within the switched conductor that replaces the attenuator section, is mitigated by reducing the stray coupling capacitances to as low a value as possible, and by using a conductor that is a section of controlled impedance transmission line that matches the system into which the attenuator relay has been placed. A substrate having SPDT LIMMS switches on either side of a switched transmission line segment and its associated attenuator, all of which are fabricated on the substrate, will have significantly lower stray coupling capacitance across the open parts of the switches when the attenuator segment is in use. This will increase the frequency for the onset of the resonance driven by the RF voltage drop across the attenuator. A reduction in the amplitude of the resonance can be obtained by including on the substrate an additional pair of LIMMS damping switches at each end of the transmission line segment. These damping switches each connect a terminating resistor to the ends of the transmission line segment when the attenuator section is in use. This loads the resonator and reduces the amplitude of the resonance. Still further improvement can be obtained by locating one of the damping switches and its termination resistor near (but preferably not exactly at) the middle of the transmission line segment.

High frequency attenuator using liquid metal micro switches

A protective coating is utilized to protect the silicon during a wet chemical etch step in the process of making a micromachine, thereby preventing the formation of etched holes or pits in the micromachine. In another embodiment, silicon sacrificial pedestals are used to eliminate or greatly reduces the electrical potential difference between metal on the glass substrate and the silicon, thereby eliminating arcing and the resulting damage to silicon and metal. These pedestals may be removed after the anodic bond.

Growing community of inventors

Colorado Springs, CO, United States of America

John Ralph Lindsey