Motorola Corporation

John R Thome

Bruce J Freyman

Frank J Juskey

Marc V Papageorge

Sypyng B Yu

Robert A Clawson

An integrated circuit package includes a stacked integrated circuit chip arrangement (140) placed on a circuit substrate. The stacked IC chip arrangement includes a first IC chip (110) and a second IC chip (120), each having an array of terminals (116, 126) and being positioned in a face-to-face manner. An interposed substrate (130) is positioned between the first IC chip (110) and the second IC chip (120) such that circuitry disposed on the interposed substrate (130) provides electrical connection among the arrays of terminals of the first IC chip (110) and the second IC chip (120) and external circuitry.

Integrated circuit package having a face-to-face IC chip arrangement

The need for solder paste or wave soldering to assemble printed circuit boards and components is eliminated by applying (100) a layer of solder to the exposed metal pads, annular rings and plated through holes of the printed circuit board. Leadless components are placed into a layer of `tack` flux applied (110) to the printed circuit board (120). The printed circuit board is heated to reflow (130) leadless components, and the solder in the holes is melted (140). The leads of the leaded components are heated (150) and inserted (160) into the molten solder in the holes. The assembly is then cooled (170) to solidify the solder around the component.

Method of soldering components to printed circuit boards

A bonding verification process which incorporates bonding test patterns and verifies the integrity of bonds by inspecting the bonding test patterns. For a bonding agent of solder, the bonding verification process verifies the integrity of solder connections by inspecting the bonding test patterns. The bonding test patterns can be implemented in a variety of configurations which verify several properties of the soldering process.

Bonding verification process incorporating test patterns

A test board is provided with a plurality of cavities that are covered by a film and arranged in a know pattern to coincide with the components to be inserted. The component lead is inserted through the film and into the cavities on the test board. The component lead is removed from the test board. The location of the resulting hole in the film is measured and compared to its intended target to determine the accuracy of the insertion equipment.

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Fort Worth, TX, United States of America

John R Thome