Indium Corporation of America

John R Sovinsky

James A Slattery

Charles E White

George E Kraeger

A lead-free alloy suitable for soldering comprising from about 82% to about 90% tin, from about 4.5% to about 6% zinc, from about 3.5% to about 6% indium and from about 1% to about 5% bismuth. The melting temperature of the alloy is preferably below 190.degree. C. and the alloy preferably has a pasty range of less than 10.degree. C.

Lead-free alloy containing tin, zinc, indium and bismuth

An alloy composition comprising effective amounts of bismuth, indium, lead, tin, and gallium, which is especially suited for lens blocking.

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Liverpool, NY, United States of America

John R Sovinsky