Atotech Deutschland Gmbh

Mcgean-rohco, Inc.

John R Kochilla

George S Bokisa

Craig V Bishop

Robert J Durante

William Bradford Staples

Morgan Bishop

William B Staples

A metal piece having an organic coating with improved corrosion resistance and adhesion is described which comprises a zinc or zinc alloy plated metal piece having on its surface, a chromate film deposited from an aqueous acidic chromium solution comprising trivalent chromium as substantially the only chromium ion present, and a cathodic electrocoated siccative organic coating on the chromate film. A process for obtaining such coated metal pieces also is described.

Metal pieces and articles having improved corrosion resistance

A printed circuit board including electrical circuitry formed on an outer surface of the printed circuit board, the circuitry comprising copper or a copper alloy; a final finish on the circuitry, the final finish including a coating of tin on the copper or copper alloy circuitry; and an alloy cap layer on the tin coating, the alloy cap layer comprising at least two immersion-platable metals. The immersion platable metals in the alloy cap layer may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt. The circuitry remains whisker free and solderable.

Tin whisker-free printed circuit board

This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.

Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom

A process of preserving solderability and inhibiting tin whisker growth of exposed copper or copper alloy surfaces on a substrate comprises the steps of preparing an immersion tin plating solution substantially free of other immersion-platable metals; applying the immersion tin plating solution to the substrate to form a tin coating on the surfaces; preparing an immersion alloy plating solution containing at least two immersion-platable metals; applying the immersion alloy plating solution to the substrate by immersing the substrate in the immersion alloy plating solution to form an alloy cap layer on the tin coating. The immersion platable metals in the immersion alloy plating solution may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt. The immersion platable metals may be added to the solution in the form of metal salts

Process for whisker-free aqueous electroless tin plating

This invention relates to an aqueous etching composition for etching metallic copper comprising

Growing community of inventors

Cleveland, OH, United States of America

John R Kochilla