The Charles Stark Draper Laboratory, Inc.

John R Burns, Iv

John Lachapelle

Jesse J Wheeler

Bryan McLaughlin

Tirunelveli Subramaniam Sriram

Andrew Czarnecki

Carlos A Segura

Caroline K Bjune

Julianne Grainger

Philip D Parks, Ii

The present disclosure discusses a method of manufacturing an implantable neural electrode. The method includes cutting a metal layer to form a plurality of electrode sites, contact pads and metal traces connecting the electrode sites to the contact pads. A first silicone layer including a mesh is formed and coupled to the metal layer. A second silicone layer is formed and laminated to the first silicone layer coupled with the metal layer. Holes are formed in the first or second silicone layer exposing the contact pads and electrode sites. Wires are welded to the exposed contact pads and a third layer of silicone is overmolded over the contact pads and wires.

Method of manufacturing an implantable neural electrode interface platform

An electrode array includes a body portion, at least one tail portion, at least one tissue surface contact, and at least one intratissue contact. The electrode array can provide stimulation or record signals from both the surface of a target tissue and within the target tissue. A system for tissue surface and intratissue signal recording and/or stimulation contains an electrode array, a controller or receiver, and at least one connection between the electrode array and the controller or receiver. A method of recording signals and/or stimulating tissue includes contacting the target tissue surface and target tissue interior with an electrode array and providing or recording an electrical, chemical, or optical signal.

Electrode array for surface and intratissue recording and stimulation

A multi-layered electronic device including two or more stacked metal conducting layers, a dielectric layer disposed between metal conducting layers, and at least one electrical connection extending between contact pads of metal conducting layers and through a through hole of the dielectric layer is provided. A system including at least one multi-layered electronic device, a satellite coupled to at least one multi-layered electronic device, and a controller hub electrically connected to the multi-layered electronic device via the satellite is also provided. A method of manufacturing the multi-layered electronic device including forming first and second first metal conducting layers, depositing a dielectric layer adjacent to the metal conducting layers, and connecting the metal conducting layers is also provided.

Multi-layered fabrication processing

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Boston, MA, United States of America

John R Burns, Iv