Adeia Semiconductor Bonding Technologies Inc.

John R Bray

Suzette Keefe Pangrle

Reynaldo Co

Scott P McGrath

Grant Villavicencio

Jeffrey S Leal

Keith L Barrie

Elmer M Del Rosario

DeAnn Eileen Melcher

De Ann Eileen Melcher

Methods for forming connectors on die pads at a wafer level of processing include forming spots of a curable electrically conductive material over die pads and extending to or over the interconnect die edge; curing the conductive material; and in a wafer cutting procedure thereafter severing the spots. Also, die pad to z-interconnect connectors formed by the methods, and shaped and dimensioned accordingly. Also, stacked die assemblies and stacked die packages containing die prepared according to the methods and having die pad to z-interconnect connectors formed by the methods and shaped and dimensioned accordingly.

Electrical connector between die pad and z-interconnect for stacked die assemblies

Growing community of inventors

San Jose, CA, United States of America

John R Bray