International Business Machines Corporation

Lenovo (singapore) Pte. Ltd.

John Paul Scavuzzo

Daniel Paul Kelaher

Paul Andrew Wormsbecher

Dean Frederick Herring

Glenn Edward Myrto

Michael D French

Richard M Barina

Karl Klaus Dittus

William Mark Megarity

Norman Bruce Desrosiers

Walter Adrian Goodman

Jeremy Scott Bridges

Camillo Sassano

Timothy Samuel Farrow

Michael Sean June

William Fred Martin-Otto

William M Megarity, Jr

Timothy M Wiwel

Rodrigo Samper

David Lee Hager

Bruce Desrosiers

Scott Womble

According to one embodiment, an enclosure includes at least one bay for insertion of a component therein, a horizontally-oriented upper wall, a horizontally-oriented lower wall, two vertically-oriented sidewalls coupled to the upper and lower walls, four integrated handles, one or more catches, and one or more interlocks, each interlock being physically configured to prevent transition of one or more handles associated therewith from the recessed position to the extended position when a component is installed in at least one bay of the enclosure, wherein two of the handles are positioned within or on an exterior of each of the vertically-oriented sidewalls of the enclosure when in the recessed position, wherein each handle is configured to extend higher than the upper wall of the enclosure when in the extended position, and wherein each handle is configured to retract to within an outer profile of the enclosure when in the recessed position.

Lift handles having safety interlocks for a rack-mounted enclosure

According to one embodiment, a system includes an enclosure configured to be removable from a rack system, the enclosure including at least one bay for insertion of a component therein, a horizontally-oriented upper wall, a horizontally-oriented lower wall, two vertically-oriented sidewalls coupled to the upper and lower walls, and a set of integrated handles, each handle being configured to transition from a recessed position to an extended position, and each handle being configured to be gripped by a hand when in the extended position, wherein each handle is configured to extend higher than the upper wall of the enclosure when in the extended position, and wherein each handle is configured to retract to within an outer profile of the enclosure when in the recessed position. Each handle is configured to rotate 180&#xb0; from the recessed position to the extended position.

A product, according to one embodiment, includes a support portion, the support portion being elongated in a first direction; and an insertion portion extending from the support portion in a second direction orthogonal to the first direction, the insertion portion having dimensions allowing insertion of the insertion portion in a card connector of a circuit board. At least an exterior of the insertion portion is electrically insulating. The support portion is wider than the insertion portion in a third direction orthogonal to each of the first and second directions.

Card stabilizer bracket

A method and apparatus for securing electronic components in an electronics system enclosure are disclosed. An apparatus can include an electronics system enclosure having a compartment adapted to receive a removable electronic component. The apparatus also includes a cam having a portion extending into the compartment sufficient to hinder insertion of the removable electronic component in a default orientation. The portion of the cam includes first and second surfaces. The portion of the cam is configured to deflect sufficient to permit insertion of the removable electronic component into the compartment in response to a normal force. The deflection causes the cam to deflect to a modified orientation. The cam portion returns to the default orientation in the absence of the normal force. The second surface of the portion is configured and arranged to engage a cam lever that is rotatably mounted to the removable electronic component.

Securing modules in an electronics system

A split chassis with a floating midplane carrier is provided. The split chassis is a modular electronic chassis which includes a first chassis section and a midplane carrier floatingly mounted to the first chassis section. The modular electronic chassis further includes a second chassis section mounted to the first chassis section, with the midplane carrier mounted between the first chassis section and the second chassis section.

Modular chassis with floating midplane carrier

A cooling apparatus of an array of fan cradles holding fans where a movable baffle assembly directs airflow and blocks removal of more than one fan at a time. A plurality of fans held in a fan cradle assembly in which the fan cradle for a fan to be replaced mechanically moves and is engaged with the movable baffle assembly to prevent removal of the other fans. A method is provided by which an operator may remove and replace an existing fan in an array of fans.

Air baffle system in a cooling system for electronics

A method and apparatus of cooling electronic components when replacing a cooling device in an information technology system are disclosed. The apparatus may include first and second cooling device trays that may be slidably mounted within an information technology system. The cooling device trays may include one or more cooling devices that are movably mounted to the cooling device trays. The apparatus may pivot one or more of the cooling devices when a pivot member contacts a fixed member with the chassis.

Adaptive cooling device positioning for electronic components

A method of forming an assembly for tool-less backplane retention and insertion thereof into a housing including a housing mating device through which an installation path for an assembly is defined with a space in which a first part is positioned is provided. The method includes coupling a hub and a backplane body having opposing faces on which a second part and a backplane mating device are respectively disposed. The coupling includes inserting a backplane mating device protruding from one of the opposing faces of the backplane body through a hub mating device defined in the hub. The method further includes forcing a first stage of a two-stage mating device, which includes first and second elastically coupled stages and which extends from the hub, to elastically hook onto the backplane body during a near-completion of the insertion.

Method of forming an assembly for tool-less backplane retention for computer hardware

A cage assembly for supporting electronic modules includes first and second support positions for first and second electronic modules, a detector for reacting to the presence of the first electronic module in the first support position and a locking mechanism configured to lock the second electronic module in the second position, wherein the presence of the first electronic module in the first position blocks premature actuation to release the locking mechanism.

Locking cage for electronic modules

An apparatus is provided and includes a housing, including a housing mating device, through which an installation path for an assembly is defined with a space in which a first part is positioned, a backplane body having opposing faces on which a second part and a backplane mating device are respectively disposed, and a hub, in which a hub mating device is defined, and from which a two-stage mating device extends, the two-stage mating device including first and second elastically coupled stages. The hub and the backplane body are coupled to form the assembly and the assembly is installed/removed in/from the space with the second stage of the two-stage mating device elastically hooked by the housing mating device or released from the housing mating device and the first and second stages of the two-stage mating device biasing the hub and the backplane body to remain coupled.

Tool-less backplane retention for computer hardware

Apparatus for securing or retaining a heatsink. The heatsink retention apparatus includes a heatsink module that cooperates with first and second spring loaded latches secure to a circuit board on opposing sides of a heat-generating component. The heatsink module includes a handle pivotally secured to opposing sides of the heatsink body, and bails pivotally secured to the handle. In addition, the bails extend downward to dispose a lower bail member adjacent the spring loaded latches. As the handle pivots between a first position to raise the bails and a second position to lower the bails, the bails automatically move from a locked position to an unlocked position. Each of the spring loaded latches include a hook and at least one pre-loaded spring to transfer a minimum downforce to the lower bail members when the bails are raised. Accordingly, embodiments may be operated from the top of the heatsink without the use of tools, while providing a desired downforce over a range of heatsink heights.

Top actuated, force limiting heatsink retention system

An apparatus, system, and method are disclosed for positioning a printed circuit board component. A clamping member applies a clamping force to a levering member linked to a positioning member. The levering member biases the positioning member toward a printed circuit board in response to the clamping force. The positioning member positions the printed circuit board and a component disposed on the printed circuit board in response to the positioning member bias. In one embodiment, the positioning member positions the component to contact a thermal device.

Apparatus, system, and method for positioning a printed circuit board component

A heat sink retention assembly for retaining a heat sink in thermal contact with a CPU while transmitting load away from the CPU. The heat sink retention assembly includes a frame sized to receive the heat sink, the frame including opposing pin capture channels and a wire module. The wire module includes an upper handle section and a lower pivoting section. The wire module is pivotably coupled to the frame at the lower pivoting section. The wire module further includes opposing end pins, wherein each pin is moveably retained within and extends through a corresponding pin capture channel such that when the wire module is rotated with respect to the frame, the pins travel within their respective channels in order to engage the heat sink.

Torsion spring force and vertical shear pin retention of heat sink to CPU

A chip sandwich includes a heat sink, a retention module, a computer chip mounted in a socket on a mother board, a wave washer spring and a mounting plate. The heat sink is mounted on the retention module using cams, hooks and heat sink tabs to provide an initial orientation of the heat sink over the computer chip. To provide final contact pressure between the heat sink and the computer chip, a wave washer spring oriented beneath the computer chip and under the mother board provides an upward pressure against the bottom of the mother board, and particularly against the center of the computer chip. Thus, by the wave washer spring pushing against the center of the computer chip, secure contact pressure is provided between the heat sink and the computer chip, while minimizing the amount of pressure between the computer chip's pins and the chip socket.

Heat sink and chip sandwich system

A computing system includes a pivoting mounting structure for mounting one or more electronic devices. The mounting structure is itself mounted to pivot between an operating position, within the computing system, and a service position, with the pivoting mounting structure extending outside the computing system for the installation or removal of electronic devices. A releasable latch prevents movement of the mounting structure from its service position.

Growing community of inventors

Cary, NC, United States of America

John Paul Scavuzzo