Lucent Technologies Inc.

Tyco Electronics Logistics Ag

John Paul Mello

Stephen A Ferranti

Madhu Ganesa-Pillai

Leon Klafter

Alan Michael Lyons

Steven John Vargo

Jeffrey Linn Bream

Joanne C Zhang

Amanda C Reeves

The present invention provides for a heat sink that, in a particularly advantageous embodiment, includes a heat sink body with a spine configured to be oriented parallel with the direction of air flow when the heat sink is coupled to a substrate. The heat sink further includes a first set of cooling fins that are coupled to and extend from the spine along a first common longitudinal axis. At least two of the first set of cooling fins laterally extend from the first common longitudinal axis in a common direction and in an offset relationship to each other.

Heat sink with offset fin profile

The present invention provides a heatsink for use with a heat-generating electrical component. The heatsink comprises a spine having opposing sides, cooling fins extending from the spine, and a dielectric layer adhered to at least one of the opposing sides. The dielectric layer has a thermal conductivity of at least about 1 W/m&deg; C. The heatsink may further comprise a metal layer adhered to the dielectric layer. The metal layer provides a surface to which an electric component can be adhered. The heatsink can further include a heat-generating component adhered to the metal layer. In another aspect, the heat-generating component is a surface-mount electrical component adhered to the metal layer with solder.

Heatsink with high thermal conductivity dielectric

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Seekonk, MA, United States of America

John Paul Mello