Motorola Corporation

Temic Automotive of North America, Inc.

Continental Automotive Systems Corporation

John Patrick Schuster

Xiaoyi Ding

Walter S Czarnocki

Jeffrey J Frye

Carl A Ross

An emission control system, such as an emission control system for a diesel engine, which includes both a NOx sensor and an electrostatic Particulate Matter (ePM) sensor, and uses the signal from the ePM sensor to determine when it is safe to activate and heat up the NOx sensor after engine ignition. This is performed as soon as moisture clears the exhaust, without having to wait any additional time as a safety factor to maximize the reliability of the NOx sensor against damage from water thermal shock. It also allows for a higher degree of application flexibility for a specific engine and aftertreatment combination to be used in a variety of vehicle applications, environmental conditions, and vehicle operating profiles.

Dew point activation method for exhuast gas sensors

A microdevice () having a hermetically sealed cavity () to house a microstructure (). The microdevice () comprises a substrate (), a cap (), an isolation layer (), at least one conductive island (), and an isolation trench (). The substrate () has a top side () with a plurality of conductive traces () formed thereon. The conductive traces () provide electrical connection to the microstructure (). The cap () has a base portion () and a sidewall (). The sidewall () extends outwardly from the base portion () to define a recess () in the cap (). The isolation layer () is attached between the sidewall () of the cap () and the plurality of conductive traces (). The conductive island () is attached to at least one of the plurality of conductive traces (). The isolation trench () is positioned between the cap () and the conductive island () and may be unfilled or at least partially filled with an electrically isolating material. There is also a method of making the same microdevice.

Wafer-level sealed microdevice having trench isolation and methods for making the same

A microdevice that comprises a device microstructure () and vent channel () in a wafer () that is sandwiched between a substrate () and a cap (). The cap () and substrate () have recesses () around the microstructure () to define a cavity. A vent () is connected to the vent channel () and subsequently to the cavity. The vent () is used to evacuate and seal the microstructure () in the cavity. A getter layer () can be used to maintain the cavity vacuum. An electrical connection can be provided through the vent (), vent channel () and cavity to the getter () to electrically ground the getter layer ().

Hermetically sealed microdevice with getter shield

A microdevice () having a hermetically sealed cavity () to house a microstructure (). The microdevice () comprises a substrate (), a cap (), an isolation layer (), at least one conductive island (), and an isolation trench (). The substrate () has a top side () with a plurality of conductive traces () formed thereon. The conductive traces () provide electrical connection to the microstructure (). The cap () has a base portion () and a sidewall (). The sidewall () extends outwardly from the base portion () to define a recess () in the cap (). The isolation layer () is attached between the sidewall () of the cap () and the plurality of conductive traces (). The conductive island () is attached to at least one of the plurality of conductive traces (). The isolation trench () is positioned between the cap () and the conductive island () and may be unfilled or at least partially filled with an electrically isolating material. There is also a method of making the same microdevice. sidewall () extends outwardly from the base portion () to define a recess () in the cap (). The isolation layer () is attached between the sidewall () of the cap () and the plurality of conductive traces (). The conductive island () is attached to at least one of the plurality of conductive traces (). The isolation trench () is positioned between the cap () and the conductive island () and may be unfilled or at least partially filled with an electrically isolating material. There is also a method of making the same microdevice.

A sensor (10) includes a plurality of sensing elements (14-20) deposed on a sensor substrate (12) and an electronic switching circuit (22) electrically connected to each of the sensing elements (14-20) for electrically selecting at least one of the sensing elements (14-20).

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Grayslake, IL, United States of America

John Patrick Schuster