Western Digital Technologies, Inc.

Molex Corporation

John Patrick Burke

Hideo Nagasawa

Michael Lavrentiev

Yoseph Pinto

Mohamad Solehin Bin Mohamed Sunar

Peir Ming Sing

Muhammad Nizam Bin Ilias

Fakhrozi Bin Che Ani

Kamarol Azmin Kamaruddin

Ibrahym Bin Ahmad

Erwan Basiron

Hari Kiran Raavi

Micro solder joint and stencil design. In one embodiment, a stencil for depositing solder on a printed circuit board (PCB) includes a plurality of stencil apertures, a first stencil aperture of the plurality of apertures having an aperture wall defining an aperture perimeter. The aperture wall is configured to not extend beyond an outer edge of a PCB pad provided on the printed circuit board, the aperture wall is also configured to not extend beyond an outer edge of a terminal of a surface mount component, and the first stencil aperture is configured to receive solder paste to form a non-convex solder joint between the PCB pad and the terminal.

Micro solder joint and stencil aperture design

Methods and apparatus for testing solder joints of a PCB assembly using fluorescent-dye penetrants. The use of a suitable fluorescent-dye penetrant may significantly improve the sensitivity of a Dye and Pry test to dye indications compared to a typical sensitivity achievable thereby with a conventional dye penetrant. Some embodiments may use an automated fluorescence imaging system employing a translation stage to sequentially move individual solder-joint parts of a circuit under test into the field of view of a fluorescence microscope and a high-resolution digital camera to capture fluorescence images of the individual solder-joint parts. The movement of the translation stage and processing of the fluorescence images may be referenced to an electronic CAD file of the circuit to enable high-precision automated scanning of the solder-joint parts in the fluorescence imaging system, automated quantification of the extent of cracks in individual solder joints, and automatic generation of examination reports.

Analyses of surface-mount-technology components using fluorescent-dye penetrants

A memory card socket interconnector is disclosed including a pair of cavities configured to receive a pair of memory cards. The cavities include patterns of memory card interconnect pads. A second surface of the socket interconnector includes socket interconnect pads, distributed across the second surface of the socket interconnector, which are electrically coupled to the memory card interconnect pads. The memory card socket interconnector may further include an anisotropic elastomeric sheet provided between the memory card pads and the memory card interconnect pads in each cavity to enable good electrical contact between the memory card pads and the memory card interconnect pads.

Socket interconnector for high pad count memory cards

A memory card socket interconnector is disclosed including a pair of cavities configured to receive a pair of memory cards. The cavities include patterns of memory card interconnect pads. A second surface of the socket interconnector includes socket interconnect pads, distributed across the second surface of the socket interconnector, which are electrically coupled to the memory card interconnect pads. The memory card socket interconnector may further include electrically conductive balls provided between the memory card pads and the memory card interconnect pads in each cavity to enable good electrical contact between the memory card pads and the memory card interconnect pads.

Socket interconnector with compressible ball contacts for high pad count memory cards

A socket includes a housing configured to receive a removable Data Storage Device (DSD) and a Thermal Interface Material (TIM). An assembly of the socket is attached to the housing and configured to expand due to heat. In a thermally expanded state, the assembly causes the TIM to come into contact with the removable DSD to draw heat away from the removable DSD. According to another aspect, a retaining strip or assembly is attached to a housing in a configuration such that the retaining strip or assembly expands due to heat to increase a resistance to removal of the removable DSD from the housing when the retaining strip or assembly is in a thermally expanded state.

Growing community of inventors

San Jose, CA, United States of America

John Patrick Burke