Hughes Aircraft Company

Delphi Technologies, Inc.

Hrl Laboratories, LLC

Other

Hughes Electronics Corporation

Gm Global Technolgoy Operations, Inc.

John Pasiecznik, Jr

Ronald Helmut Haag

Jonathan James Lynch

Jeremy M Husic

Peter Petre

Sarabjit Mehta

Brian Deplae

William R Crumly

Blake F Woith

Robert K Betz

Timothy J Talty

Daniel Frederic Sievenpiper

Hui-Pin Hsu

Oberdan W Otto

James F Frazier

A control system and method for controlling switching between and among multiple antennas in a diversity antenna system comprising a radio head unit associated with a radio receiver; two or more antennas, either located in separate antenna modules or co-located in the same antenna module; a switch circuit; and a single cable. Control signals for controlling switching are provided as changes in a DC power supply signal carried on the single cable. In the case of multiple antenna modules, the radio head unit and the antenna modules are connected by the single cable using a daisy-chain architecture.

Control system and method for diversity antenna system

A device for varying the capacitance of an electronic circuit is disclosed. The device comprises a flexible membrane located above the electronic circuit, a metal layer connected to the flexible membrane, and bias circuitry located above the membrane. Variation of the capacitance of the electronic circuit is obtained by pulling the membrane upwards by means of the bias circuitry. The disclosed device provides a sizeable capacitance variation and high Q factor, resulting in overall low filter insertion loss. A nearly constant group delay over a wide operating bandwidth is also obtained.

Variable capacitance membrane actuator for wide band tuning of microstrip resonators and filters

A non-contact detection system and method for detecting obstructions in relation to a powered door on a vehicle such that contact with the door may be prevented. The detection system includes an object detection sensor located on the powered door for sensing an object within an adjustable sensing zone. A door position sensor senses position of the door relative to at least one of an open and closed door position. A controller adjusts the sensing zone of the object detection sensor as a function of the sensed door position.

Powered door object detection system and method

A method for detecting a change in capacitance of a capacitive sensing element having a nominal capacitance value is disclosed. In an exemplary embodiment, the method includes coupling the sensing element to a first oscillator, the first oscillator generating a first frequency dependent upon the capacitance value of the sensing element. The first frequency is compared to a reference frequency generated by a second oscillator. The change in capacitance from the nominal capacitance value is detected if the first frequency differs from said reference frequency by a determined frequency value.

Method and apparatus for detecting a change in capacitance of a capacitive proximity sensor

A non-contact obstacle detection system utilizing ultra sensitive capacitive techniques. In an exemplary embodiment, the system includes a sensing element disposed in proximity to a moveable panel and a proximity detection circuit in communication with the sensing element. The proximity detection circuit generates a differential output signal reflective of whether a foreign object is in proximity to the sensing element. In addition, a central control module is in communication with the sensing element. The central control module determines whether the differential output signal is reflective of a foreign object in proximity to the sensing element. If the central control module determines that the differential output signal is reflective of a foreign object in proximity to the sensing element, and the moveable panel is moving toward a closed position, then the central control module generates a control output signal to stop the moveable panel from moving toward the closed position.

Non-contact obstacle detection system utilizing ultra sensitive capacitive sensing

A flexible, capacitive strip for use in a non-contact obstacle detection system is disclosed. In an exemplary embodiment, the strip includes an elongated body for flexible mounting to a panel along a bottom surface of the elongated body. A first elongated planar conductor is contained within an upper section of the elongated body, and a longitudinal cavity is formed through a central portion of the elongated body, the longitudinal cavity being disposed between the planar conductor and the bottom surface. The first elongated planar conductor forms a first electrode of a sensing capacitor and the longitudinal cavity defines a portion of a dielectric material of the sensing capacitor.

Flexible capacitive strip for use in a non-contact obstacle detection system

A capacitive sensor assembly is disclosed. In an exemplary embodiment, the assembly includes a capacitive strip having an elongated body for flexible mounting to a panel along a bottom surface of the elongated body. A first elongated planar conductor is contained within an upper section of the elongated body, while a longitudinal cavity is formed through a central portion of the elongated body. The longitudinal cavity is disposed between the planar conductor and the bottom surface. A capacitance detector module is inserted within the longitudinal cavity, the capacitance detector module including a capacitance detector circuit therein that is coupled to the first elongated planar conductor.

Capacitive sensor assembly for use in a non-contact obstacle detection system

Transverse-folded antennas arrange a radiator, twist reflectors and a transreflector to generate a radar beam without blocking the beam with a feed element. The arrangement provides signal access at an antenna rear face which facilitates integration of the antenna into an automotive radar system. Different embodiments of the antenna collimate the radar beam with curved twist reflectors and with lenses. Scanning is effected with rotatable twist reflectors and with scanning radiators.

Transverse-folded scanning antennas

A membrane probe (10, 12, 14, 16, 58, 144) for testing integrated circuits (56,138) while still on the wafer upon which they are manufactured includes a flexible visually clear and self planarizing membrane (26) having circuit traces (20) and ground shielding planes (14), terminating resistor (152) and active buffer chips (172) formed thereon. Probe contact pads (36,38) electroplated on areas of the traces, and connector pads (32) plated on the membrane facilitate rapid detachable connection to a test fixture (50). The probe has a configuration, dimension and structure like that of the wafer itself so that automated pick and place equipment (136,142) employed for handling the wafers (138) may also be used to handle the probes (144). An unique test fixture (50) is adapted to receive and detachably secure a selected probe to the fixture. A metal-on-elastomer annulus (88,104) is employed in the test fixture to make electrical contact between contact pads (32) plated on the back side of the membrane probe and a printed circuit board that is used to route signals to the testing equipment.

Method of testing integrated circuits

A membrane probe (10) for simultaneously testing two or more alternate columns or rows of integrated circuit chips (14) on the processing wafer (12) includes a flexible transparent and self planarizing membrane (22). The membrane includes circuit traces (26) and is carried by a substrate (16) defining parallel ports (18) corresponding to alternate columns or rows of circuit chips (14). Active test circuitry units (48) are mounted on the substrate (16) to perform test functions close to the site of testing. Two probes (10,110) are employed for testing each full wafer. One membrane probe (10) contains ports (18) and membrane segments (22) corresponding to one set of chips on the processing wafer, while the other probe (110) containing ports (18) and membrane segments (22) for the other interlaced set of chips on the wafer. Contact pads (34) are provided on areas of the membrane traces (26) to be visually registered through the membrane with contact pads of the chips under test. A test fixture insert (54) receives either membrane test probe (10, 110) and cooperatively forms a sealed chamber (80) in which pressurized gas urges the contact pads (34) against the contacts pads of the chips (14) for testing. Sufficient space on the surface of the test head (10,110) is provided for mounting active test circuit units (48) on the membrane test heads.

Active circuit multi-port membrane probe for full wafer testing

A membrane probe (10) for simultaneously testing two or more columns or rows of integrated circuits (37) while still on the wafer (56) upon which they are manufactured includes a flexible visually clear and self planarizing membrane (18) having circuit traces (22). A substrate (12) on which the membrane (18) is mounted features parallel ports (14) corresponding to alternate columns or rows of circuit chips (37) on the wafer to be tested. Two such substrates (12,112) thus forming two alternately used probe test heads (10,110) are employed for testing each full wafer, one test head (10) containing ports (14) corresponding to one set of alternate wafer columns or rows, the other test head (110) containing ports (114) corresponding to the remaining interlaced wafer columns or rows. Probe contact pads (30) are electroplated on areas of the traces (22) so that the contact pads (30) are visually registrable through the substrate ports. The probe test heads (10,110) have a configuration, dimension and structure like that of the wafer (56) itself so that automated pick and place equipment employed for handling the wafers (56) may also be used to handle the probe test heads (10,110). A unique pair of test fixture inserts (34,134) is adapted to receive and detachably secure a selected probe test head (11,110) to the its corresponding test fixture insert.

Multiport membrane probe for full-wafer testing

A flexible membrane (12) of an integrated circuit chip test probe is provided with raised contact features (14) on one side arranged in the pattern of contact pads of the chip to be tested. During manufacture, the membrane, in the area of its raised contact features, is specifically shaped by applying a vacuum to the outside of the membrane and casting a solid resilient elastomer (26) in place on the other side of the membrane to act as a shape retaining solid backup and to provide an anti-drape (226) shaped membrane (212) or to ensure planarity (326) of the ends of the membrane contact features (314). The vacuum may be used to pull the membrane and its contacts against a shape defining mandrel (60, 260, 360) while the elastomer is cast into place.

Cast elastomer/membrane test probe assembly

A flexible membrane (12) of an integrated circuit chip test probe is provided with raised contact features (14) on one side arranged in the pattern of contact pads of the chip to be tested. During manufacture, the membrane, in the area of its raised contact features, is specifically shaped by applying a vacuum to the outside of the membrane and casting a solid resilient elastomer (26) in place on the other side of the membrane to act as a shape retaining solid backup and to provide an anti-drape (226) shaped membrane (212) or to ensure planarity (326) of the ends of the membrane contact features (314). The vacuum may be used to pull the membrane and its contacts against a shape defining mandrel (60,260,360) while the elastomer is cast into place.

Growing community of inventors

Malibu, CA, United States of America

John Pasiecznik, Jr