Hewlett-packard Company

Hewlett-packard Development Company, L.P.

John P Whitlock

Charles Craig Haluzak

Douglas A Sexton

Martha A Truninger

Mark Alan Johnstone

Zhizang Chen

Phillip R Coffman

Genbao Xu

Theodore I Kamins

Ali Emamjomeh

Brian J Keefe

George H Corrigan

Michael John Regan

Min Cao

Victor Joseph

Ulrich E Hess

Domingo A Figueredo

Roger J Kolodziej

Gregory T Hindman

Ravi Ramaswami

Anil Prem

A fluid-jet printhead has a substrate having at least one layer defining a fluid chamber for ejecting fluid. The printhead also includes a resistive layer disposed between the fluid chamber and the substrate wherein the fluid chamber has a smooth planer surface between the fluid chamber and the substrate. The printhead has a conductive layer disposed between the resistive layer and the substrate wherein the conductive layer and the resistive layer are in direct parallel contact. The conductive layer forms at least one void creating a planar resistor in the resistive layer. The planar resistor is aligned with the fluid chamber.

Method of fabricating a fluid jet printhead

Fluid-jet printhead and method of fabricating a fluid-jet printhead

A process for creating and an apparatus employing reentrant (pointing or directed inward) shaped orifices in a semiconductor substrate. A layer of graded dielectric material is deposited on the semiconductor substrate. A masked photoimagable material is deposited upon the graded dielectric material and exposed to electromagnetic energy such that a patterned photoimagable material is created. The patterned photoimagable material is developed to unveil the graded dielectric material which is then anisotropically etched. The bore in the graded dielectric material is then isotropically etched to complete the creation of holes in the substrate.

In-situ fluid jet orifice

A highly-efficient thermal inkjet printhead. The printhead includes a primary layer of polycrystalline silicon (preferably doped) having at least one portion thereof which functions as an ink expulsion resistor. Positioned over and above the primary layer is a secondary layer of material having at least one section produced from a selected metal silicide compound and at least another section fabricated from undoped polycrystalline silicon. The metal silicide-containing section functions as an interconnect structure and is operatively connected to the resistor in the primary layer (which is positioned beneath the secondary layer). The undoped polycrystalline silicon section is at least partially aligned over and above the resistor. As a result, the resistor is &ldquo;buried&rdquo; beneath the secondary layer and the various portions thereof. This system provides improved reliability, greater dimensional simplicity, optimized electrical/thermal properties, and superior versatility.

Thermal inkjet printhead and high-efficiency polycrystalline silicon resistor system for use therein

A thermal ink jet printhead that includes a thin film substrate including a plurality of thin film layers, a plurality of ink firing heater resistors defined in the plurality of thin film layers, a patterned tantalum carbide layer disposed on the plurality of thin film layers, an ink barrier layer disposed over the tantalum carbide layer, and respective ink chambers formed in the ink barrier layer over respective thin film resistors, each chamber formed by a chamber opening in barrier layer. The tantalum carbide layer forms an oxidation and wear resistance layer and/or a barrier adhesion layer.

Transition metal carbide films for applications in ink jet printheads

An interconnect structure and method for forming the same for electrically connecting a main contact point with a plurality of use points. The interconnect structure includes a uniform high resistance layer. A low resistance layer is formed on the uniform high resistance layer. The low resistance layer defines first and second conductors extending between a main contact point and corresponding first and second use points. The first conductor has a corresponding conductor width that is, at least in part, based on a resistance between the first and second conductors.

Segmented electrical distribution plane

Growing community of inventors

Lebanon, OR, United States of America

John P Whitlock