Teradyne, Inc.

John P Toscano

Philip Luke Campbell

Brian S Merrow

Evgeny Polyakov

Christopher J Bruno

Jianfa Pei

David Paul Bowyer

Eric Lenhart Truebenbach

Edward Garcia

Marc LeSueur Smith

Brian J Whitaker

Valquirio Nazare Carvalho

Sean Patrick Adam

Anthony J Suto

Joseph Francis Wrinn

Adnan Khalid

John Joseph Arena

Jack Michael Thompson

Michael O McKenna

David Graziose

Rhonda L Allain

Sten J Peeters

Urszula B Tasto

An example test socket for a test system includes a receptacle to make electrical and mechanical connections to a device under test (DUT) and a lid to cover the DUT in the receptacle. The lid is controllable to open automatically to enable receipt of the DUT in the receptacle and, following receipt of the DUT, to close automatically to cover the DUT in the receptacle. Closing the lid applies force to the DUT to complete the electrical and mechanical connections between the test socket and the DUT.

Test socket having an automated lid

An example test system includes packs. The packs include test sockets for testing devices under test (DUTs) and at least some test electronics for performing tests on the DUTs in the test sockets. Different packs are configured to have different configurations. The different configurations include at least different numbers of test sockets arranged at different pitches.

Modular automated test system

An example test system includes a test socket for testing a DUT, a lid for the test socket, and an actuator configured to force the lid onto the test socket and to remove the lid from the test socket. The actuator includes an upper arm to move the lid, an attachment mechanism connected to the upper arm to contact the lid, where the attachment mechanism is configured to allow the lid to float relative to the test socket to enable alignment between the lid and the test socket, and a lower arm to anchor the actuator to a board containing the test socket. The actuator is configured to move the upper arm linearly towards and away from the test socket and to rotate the upper arm towards and away from the test socket.

Test site configuration in an automated test system

An example test system includes robotics configured to operate on devices at a first level of precision, and stages configured to operate at levels of precision that are less than the first level of precision. Each of the stages may include parallel paths that are configured to pass the devices between adjacent stages.

Automated test system employing robotics

An example test system includes a test carrier to hold devices for test; a device shuttle to transport the devices; and a robot to move the devices between the test carrier and the device shuttle. The device shuttle is configured to move, towards a stage of the test system containing the robot, a first device among the devices that has not been tested. The device shuttle is configured to move in a first dimension. The robot is configured to move the first device from the device shuttle to the test carrier. The robot is configured to move in a second dimension that is different from the first dimension.

Automated test system having orthogonal robots

An example test system includes: a test rack including test slots; first and second shuttles that are configured to move contemporaneously to transport devices towards and away from trays, with at least some of the devices having been tested and at least some of the devices to be tested; first and second robots that are configured to move contemporaneously to move the devices that have been tested from test sockets in test carriers to the first and second shuttles, and to move the devices to be tested from the first and second shuttles to the test sockets in test carriers; and first and second test arms that are configured to move contemporaneously to move the test carriers between the first and second robots and the test rack.

Automated test system having multiple stages

An example test fixture, which interfaces a tester and a unit under test (UUT), includes the following: first electrical contacts that face the tester; second electrical contacts that face the UUT; a substrate made of sections of printed first material, with the first material being electrically non-conductive, and with the substrate being between the first electrical contacts and the second electrical contacts; and structures through the substrate, with the structures including sections of second material, with the second material being electrically conductive, and with at least one of the structures electrically connecting a first electrical contact and a second electrical contact.

Test fixture

A test rack for a storage device testing system includes a plurality of test slot carriers. Each of the test slot carriers includes a plurality of test slot assemblies. The test slot assemblies are configured to received and support storage devices for testing. The test rack also includes a chassis. The chassis includes a plurality of carrier receptacles for releasable receiving and supporting the test slot carriers. The test slot carriers are interchangeable with each other among the various carrier receptacles.

Test slot carriers

A method of transferring storage devices within a storage device testing system includes actuating an automated transporter to substantially simultaneously retrieve multiple storage devices presented for testing, and actuating the automated transporter to substantially simultaneously deliver each retrieved storage device to a respective test slot of the storage device testing system and substantially simultaneously insert each storage device in the respective test slot.

Transferring storage devices within storage device testing systems

An adapter frame is configured to receive a non-native test instrument module and is further configured for coupling within a test head of automatic semiconductor device test equipment. The adapter frame includes interfaces for operatively connecting the test instrument module to the test head using the existing slots of the test head. Interfaces may include mechanical interfaces, such as liquid cooling interfaces and other suitable interfaces. Additional software and/or hardware components may be included on the adapter frame to integrate the non-native test instrument module into the existing test equipment.

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Auburn, MA, United States of America

John P Toscano