Amp LLC

Other

John P Redmond

Ray N Shaak

Albert Shirk

Clair W Snyder, Jr

Anil C Thakrar

Daniel Marshall Andrews

Paul C Schubert, Jr

Joseph F Merlina

George Ulbrich

William S Scheingold

Richard Henry Zimmerman

Warren C Jones

Richard M Wagner

Larry J Wilt

Larry A Cracraft

Ray N Sheak

Karl Edward Guyler

Elmer John Bottiglier

A method and product for providing an electrical interconnection between components and a substrate includes the use of an adhesive coating. The coating (40,42) is applied between the contacts (14,22) of component and substrate and the surface of a conductive fiber-filled, elastomeric connector (30) and is operable to bond the contacts to the surfaces of the connector with conductive fibers (34) of the connector piercing the adhesive coating to provide multiple contacts (36,38) and define current paths for the interconnection while mechanically bonding connectors, components, and substrate together. Protective covers (44) are applied to connectors to protect the adhesive coatings prior to use with sheets (50) or rolls (52) alternatively used to carry arrays of connectors in patterns corresponding to substrate contacts (14,22).

Fiber-filled elastomeric connector attachment method and product

An electrical connector 63 includes at least one length of wire 54 having an insulating means 55 with at least one portion 58 of the wire 54 extending free from the insulating means 55 and a housing 62 adapted to hold the free end 58 and a length of the insulating means relative to a first contact point 102 on an electrical article 100 to be interconnected with connector 63 to wire 54. Wire 54 includes one portion 56 inelastically deformed to provide a second contact point 60 adapted to engage said first contact point 102. Housing 62 includes portions adapted to position the second contact point 60 in bearing relationsip with the first contact point 102 with the spring beam 56 being deflected to provide a normal force engagement between the first and second 102, 60 contact points sufficient to assure a stable, low resistance interface.

Electrical connector and cable utilizing spring grade wire

An electrical connector (14) for interconnecting circuit boards (12, 50) includes an elastomeric pad (34, 36) having sharp fiber ends (42, 46) resiliently driven to penetrate oxides to provide an anisotropic, low resistance, stable electrical interface between the board circuits when driven by spring contacts (28, 32) in one embodiment, and by rigid contacts (64, 72) in another embodiment, wherein the pad is positioned to seal the interconnector by covering the connector interior.

Elastomeric connector with contact wipe

A mold 300 for making a member having at least one first section of a first material and at least one second section of a second material includes first and second plates or mold halves 332,334 adapted to cooperate with each other when positioned in opposing relationship along a mold-closing axis and reciprocally movable relative to one another along the axis during a molding cycle. The first and second plates or mold halves 332,334 define a member-forming area therein when the mold is in a closed position. Sprues in the first and second plates or mold halves are in communication with the portions of the first and second sections respectively of the member-forming area. An ejector 348 for ejecting an eventually mold member includes one surface defining a boundary of the member-forming area. The ejector is movably disposed in one of the plates and is movable into the member-forming area. The ejector 348 is positionable in a first position such that the first material is introduceable through the at least one first sprue 356 while another surface of the ejector blocks the at least one second sprue. The ejector 348 is then positioned in a second position within the member-forming area such that the second sprue is uncovered. The second material is introduced into the second portion 212 of the member-forming area through the at least one second sprue.

Dual injection molding apparatus

An electrical connector 63 includes at least one length of wire 54 having an insulating means 55 with at least one portion 58 of the wire 54 extending free from the insulating means 55 and a housing 62 adapted to hold the free end 58 and a length of the insulating means relative to a first contact point 102 on an electrical article 100 to be interconnected with connector 63 to wire 54. Wire 54 includes one portion 56 inelastically deformed to provide a second contact point 60 adapted to engage the first contact point 102. Housing 62 includes portions adapted to position the second contact point 60 in bearing relationship with the the first contact point 102 with the spring beam 56 being deflected to provide a normal force engagement between the first and second 102,60 contact points sufficient to assure a stable, low resistance interface.

A high density electrical connector assembly, and method of manufacturing same. More particularly, the invention covers an essentially flat, woven screen formed of a plurality of substantially parallel, electrically conductive wires forming the warp wires thereof, where such wires may be as small as 2 mils in diameter. Arranged essentially perpendicular thereto are plural, spaced apart, insulative woof filaments. To one major face of said flat, woven screen is applied a hot laminating film to encapsulate said wires, while to such other major face a comparable film is applied. However, for such other face, the encapsulating film is not coextensive with the screen length, but rather is spaced from the ends thereof so as to provide for connector contacts on each such wire. If desirable, the contacts may be plated. The invention also contemplates means for electrically interconnecting the assembly hereof to a high density circuit pattern, such as found on a PC board.

High density woven wire harness assembly

An environmentally sealed chip carrier housing for mounting on a printed circuit board. The housing is formed of a dielectric material and comprises a base and an upstanding circular side wall, one surface of which is threadably configured for receipt of a cover member. The base is further provided with plural slots for receiving a like plurality of elongated elastomeric compressive type connectors, and support means for receiving a chip carrier thereon. A cover member is provided for threadably engaging the housing. The cover member is characterized by a top having a peripheral wall thereabout, where the top has a uniformly convex configuration such that the center portion is thicker than the outer portions thereof. By this arrangement, when the cover member is positioned over the housing containing a chip carrier to threadably engage the cover member with said housing, a uniform pressure is applied to said chip carrier, which in turn will exert a uniform pressure against the elastomeric compressive type connectors. Further, the chip carrier is environmentally sealed.

Sealed chip carrier

Provided herein are novel layered elastomeric connectors, housings therefor and methods of manufacture for the connectors which includes alternating fused layers of a dielectric elastomer and electrically conductive fibrous mats coextensive with a cross section of the conductor to provide a multiplicity of conductive pathways between two electrically conductive surfaces. In order to promote a more mechanically stable connector, the fibrous mats can be exposed to a coupling agent for enhanced bonding. To enhance the electrical characteristics, the fibrous mats can be electroplated with an electrically conductive metal.

Process of making a layered elastomeric connector

An environmentally sealed electrical connector is comprised of plug and receptacle housing members, each member having a rigid portion and a flexible portion secured to one end thereof, and at least one electrical terminal receiving passageway extending through the rigid and flexible portions. The flexible portions of the passageways are dimensioned to accommodate and sealingly engage a variety of wire sizes terminated to electrical terminals which are received and disposed in the passageways of the assembled member. The plug member may be further comprised of a second flexible section secured at the other end of the rigid section, the second flexible section providing a resilient sealing member for environmentally sealing the interface when the receptable and receptacle members are mated.

Environmentally sealed connector

An elastomeric connector assembly (2) is disclosed for making electrical contact between a first electrical component (52) and a second electrical component (54). The connector assembly has at least one housing member (4, 6) which has a plurality of terminals (12, 14) and an elastomeric connector (16, 18) provided therein. The elastomeric connector electrically engages the terminals to provide numerous electrical pathways which extend through the housing member (4, 6) of the connector assembly (2). A camming means (8, 10) is provided proximate the housing member (4, 6), such that as the camming means (8, 10) is moved from a first position to a second position, the elastomeric connector (16, 18) is compressed to insure that a reliable electrical connection is effected and maintained between the the first electrical component (52) and the elastomeric connection (16, 18), and between the elastomeric connector and the terminals (12, 14).

Elastomeric connector assembly

Provided herein are novel layered elastomeric connectors, housings therefor and methods of manufacture for the connectors which includes alternating fused layers of a dielectric elastomer and electrically conductive fibrous mats coextensive with a cross section of the conductor to provide a multiplicity of conductive pathways between two electrically conductive surfaces.

Layered elastomeric connector and process for its manufacture

A surface mountable integrated circuit chip package is taught. Briefly stated, a flexible laminate having conductive strips thereon is wrapped around a heat sink. Plastic is molded around the laminate-heat sink piece, with a window left in the center thereof, which coincides with a window in the laminate. An integrated circuit chip is then bonded to the heat sink with wire leads then run from the chip to the conductive strips on the laminate. A potting material is then placed in the window thereby completely encapsulating the integrated circuit chip so as to prevent exposure to environmental or physical damage. This thereby forms a package which is surface mountable to a circuit board through attachment techniques such as the vapor phase soldering.

Surface mounted integrated circuit chip package and method for making

An integrated circuit package for establishing electrical contact with the terminal areas or pads of an integrated circuit chip comprises an insulating substrate having a flat surface in which there are embedded a plurality of electrodeposited conductors. The conductors have inner ends in a chip-receiving zone of the flat surface and have outer end portions which are remote from the chip-receiving zone. The inner ends of the conductors have contact bumps or promontories extending above the flat surface and located such that when a chip is placed on the promontories, they will be against the terminal areas of the chip. The chip can be held against the promontories by a suitable clamping means and contact established with the conductors at their outer ends by suitable connecting means. The device is particularly useful for testing chips prior to their being placed in service. The integrated circuit package is produced by etching depressions in a copper foil, electrodepositing conductors in the depressions and on the surface of the foil while controlling the locations of the conductors by suitable masking, molding the substrate against the foil so that the conductors are embedded in the substrate, and then etching away the copper foil.

Integrated circuit package and manufacturing method

An improved chip carrier of thin dieletric deformed into a dish configuration provided with flexible mounting flanges on which are plated or bonded solderable conductive traces and paths together with plated or bonded heat sinks which may be referenced to ground potential, and which provides structural integrity.

Chip carrier

Deposition of metal onto a polyimide film by an electroless method is disclosed. The subject method finds particular application in generating metal patterns on polyimide substrates, such as films. The subject method employs a photographic like technique for generating on a polyimide substrate, a pattern capable of attracting thereon a precious metal-salt which is useable as a catalyst in an electroless plating process. The methods disclosed are useable in an electroless plating process to produce a metallic pattern, such as an electric circuit pattern for mounting integrated circuit chips, etc.

Growing community of inventors

Mechanicsburg, PA, United States of America

John P Redmond