Hewlett Packard Enterprise Development LP

Hewlett-packard Development Company, L.p.

Hewlett Packard Enterprise Patent Department

John P Franz

Tahir Cader

Wade David Vinson

Harvey John Lunsman

Joseph R Allen

David Allen Moore

Michael Lawrence Sabotta

Troy Anthony Della Fiora

Keith J Kuehn

Belgie B McClelland

Alan B Doerr

John Robert Grady

Steven J Dean

Everett R Salinas

Ernesto Ferrer Medina

William Kirk Norton

Kevin B Leigh

Robert J Kelley

Chris F Felcman

Matthew Richard Slaby

David W Deis

John Norton

Melvin K Benedict

Michael Scott

Yinggang Du

Jeffery Michael Giardina

Ernesto Ferrer

Benjamin Kufahl

Douglas Kent Garday

Greg Scott Long

Brian T Purcell

David W Sherrod

David A Selvidge

Vincent W Michna

Yousef M Jarrah

John D Nguyen

Jon Kolas

Arthur G Volkmann

Binh Nguyen

Thomas Robert Bowden

Robert Mascia

Ronald D Noblett

David L Vaughn

Ernesto J Ferrer

Cullen Edwin Bash

Zhiyong Li

George D Megason

David F Heinrich

Anita Rogacs

Kelly Kennedy Smith

Thomas T Hardt

Patrick A Raymond

Belgie B McClelland, Ii

Charles W Cochran

Jeoff M Krontz

David M Paquin

Michael White

Thomas D Rhodes

Timothy A McCree

Phi A Nguyen

Erik Robert Nielsen

Andrew James Phelan

Arthur K Farnsworth

Niru Kumari

Zheila N Madanipour

Eric Mei

Jonathon Hughes

Richard Bargerhuff

Paul Danna

M Scott Bunker

Stephen Kay

Tuan A Pham

Sergio Escobar-Vargas

Sammy L Zimmerman, Sr

Keith Mathew McAuliffe

Michael E Taylor

Jim B Duke

Art Volkmann

Steven D Webster

Nicholas Holian

Brady Dulian

Allen B Doerr

Michael Hanson

Suzie Mkandawire

Laura Malcotti-sanchez

Gardson Githu

Rahul V Joshi

Curt S Belusar

John Vijil

Jeffrey M Giardina

Charles R Hanna

Walton S Little, Jr

A circuit board cooling apparatus is disclosed having a heat spreader device to be thermally coupled with a surface of the circuit board to be cooled. Also, a conforming heat transfer device is disclosed that is thermally and physically coupled with the heat spreader device to conform to a surface contour of the heat spreader device on a first side of the heat transfer device. The cooling apparatus also includes a heat transport device physically attached and thermally coupled with a second side of the heat transfer device.

Conforming heat transport device for dual inline memory module cooling applications

One aspect described in this application provides an apparatus that includes an external tray hose with an integrated booster pump for cooling a computing device. The booster pump can boost fluid flow and fluid pressure of coolant fluid pumped toward the computing device on a server tray. The booster pump includes a stator mounted around a booster pump housing with a bore. The stator includes one or more C-shaped lamination stacks for supporting coil windings. Energized coil windings generate a varying magnetic field for rotating an impeller within a housing bore to pump fluid along the housing bore of the booster pump. The apparatus includes a monitor module to monitor a set of sensors to obtain information about one or more of fluid temperature, fluid pressure, and device temperature; and a control module to adjust performance of the booster pump based on the information obtained from the set of sensors.

External tray hose with integrated pump

A heat removal apparatus may comprise a vapor chamber device and a cover coupled to the vapor chamber device. The vapor chamber device comprises a base, a folded fin structure coupled to the base, with the base and folded fin structure defining a vapor chamber containing a wick and a working fluid. The cover and the vapor chamber device define a liquid chamber configured to receive liquid coolant. The folded fin structure comprises a plurality of folded fins defining a first plurality of grooves on a first side of the folded fin structure and defining a second plurality of grooves on a second side of the folded fin structure. The first plurality of grooves are part of the vapor chamber. The second plurality of grooves are part of the liquid chamber.

Folded-fin vapor chamber cold plate

A pair of fluid couplings for liquid cooling electronic devices comprises a first fluid coupling and second fluid coupling. The first fluid coupling comprises a female coupling interface and the second fluid coupling comprises a male coupling interface to couple with the female coupling interface. Each of the fluid couplings comprises a magnetic latch assembly coupled to the coupling interface thereof. Each magnetic latch assembly comprises a shell, magnets housed within the shell, and a group of ramp-and-hook latches coupled to the shell. The magnets cause the magnetic latch assemblies to magnetically attract one another during coupling, reducing the force a user may need to apply to complete the coupling. The ramp-and-hook latches of one magnetic latch assembly are complementary to the ramp-and-hook latches of the other magnetic latch assembly, and they are arranged to engage with one another and interlock when the first and second fluid couplings are coupled.

Fluid couplings with magnetic latch assembly

Example implementations relate to an electronic system providing thermal management of a removable device when connected to a host device of the electronic system including a receptacle, and a heat transfer device having first and second portions. The host device has a cooling component. The removable device having a heat spreader, is detachably coupled to the host device. The receptacle having spring fingers, is coupled to one of the cooling component or the heat spreader. The first portion is coupled to one of the cooling component or the heat spreader, and the second portion is protruded outwards. When the removable device is connected to the host device, the second portion extends through the receptacle such that the spring fingers establish direct thermal interface with the second portion to allow waste-heat to transfer between the heat transfer device and one of the cooling component or the heat spreader via the receptacle.

Receptacle with connectable spring finger for multipoint contact conduction cooling

A non-circular disconnect, comprising: a male body to insert into a non-circular female disconnect; a male poppet, wherein: when the non-circular disconnect is not inserted into the non-circular female disconnect, the male poppet is held in place, via spring force, at an opening of the non-circular male body to create a seal to prevent leakage; and when the non-circular disconnect is inserted into the non-circular female disconnect, the male poppet is pushed inwards, to allow for liquid to flow through the non-circular disconnect, by a plunger in the non-circular female disconnect.

Disconnects

In the examples provided herein, a system includes an electrochemical sensor having two electrodes inserted in a fluid to be tested, where an alternative current (AC) voltage is applied across the two electrodes; an electrochemical sensor having two electrodes inserted in a fluid to be tested, wherein an alternative current (AC) voltage across the two electrodes; and a frequency response analyzer to analyze the measured the electrical response across multiple frequencies. The system also includes a memory to store a baseline of the electrical response across multiple frequencies, and a processor to determine from the stored baseline and the measured electrical response whether the electrical response is outside a predetermined range.

Electrical frequency response fluid analysis

A system chassis may comprise a frame having a width, depth, and height and a plurality of divider walls coupled to the frame and forming a plurality of receptacles each configured to receive an electronics tray containing an electronic assembly. Each of the plurality of divider walls comprises a metal sheet having a front edge, a back edge, and two lateral edges, the two lateral edges attached to two lateral walls of the frame. The front edge of the metal sheet has a concave shape such that a distance between the front edge and the back edge of the metal sheet continuously decreases while moving laterally from one lateral edge to a center of the front edge and continuously increases while moving laterally from the center to the opposite lateral edge.

System chassis with divider walls having a concave edge

An example axial pump for delivering liquid coolant to cool an electronic device comprises a conduit defining a flow path from an inlet of the conduit to an outlet of the conduit and an impeller in the conduit. The impeller is rotatable about an axis of rotation parallel to the flow path. The pump also has a motor stator configured to drive rotation of the impeller body about the axis of rotation. In addition, the pump comprises an adjustment mechanism coupling the impeller to the conduit. The adjustment mechanism is actuatable to cause translation of the impeller relative to the conduit. This may allow for adjustment of a clearance between a blade tip of a blade of the impeller and a wall of the conduit.

Axial pump with adjustable impeller

Switch sub-chassis systems and methods for rack-scale servers are disclosed. A switch sub-chassis is arranged for modular installation in an enclosure and includes structural support features that allow multiple hot-serviceable line-cards and an integrated high-density optical fiber connectivity within the sub-chassis. Various features of the switch sub-chassis and associated line-cards allow liquid-electro-optical blindmate of the line-cards so that the line-cards are serviceable, allow high-density and complex fiber shuffle assemblies support, and facilitate ease of installation and/or servicing of fiber assemblies.

Switch sub-chassis systems and methods

A screw-latching assembly is provided. The assembly includes a screw with a head, a tip, and a body between the head and tip. The body includes a threaded portion adjacent to the tip and an unthreaded portion adjacent to the head, and the unthreaded portion includes a built-in collar with an outer diameter larger than that of the body. The assembly includes a supporting bracket supporting and partially encompassing a first portion of the screw. The supporting bracket includes a base and multiple sidewalls, with a first sidewall comprising a first opening to allow a second portion of the screw to extend out of the supporting bracket and a second sidewall comprising a second opening to allow access to the head by a torquing tool. The assembly includes a spring surrounding at least a portion of the body, with the spring positioned between the built-in collar and the first sidewall.

Compact screw-latching assembly with overdrive protection

Example implementations relate to a chassis cooling resource. In some examples, a chassis cooling resource includes a controller, comprising instructions to detect a failure corresponding to a first cooling system of a first chassis coupled to a server rack, and alter settings of a second cooling system of a second chassis coupled the server rack to provide additional cooling resources to the first cooling system in response to the detected failure.

Chassis cooling resource

An electronic component enclosure includes a plurality of wall structures defining outer walls of the enclosure. Each wall structure has an internal fluid channel for circulation of cooling fluid. The enclosure further includes at least one partition structure disposed within the outer walls and having an internal fluid channel in sealed fluid communication with the internal fluid channel of at least one of the plurality of wall structures. The internal fluid channel of at least one of the plurality of wall structures and the internal fluid channel of the at least one partition structure defines a continuous fluid circulation path between a fluid inflow port and a fluid outflow port.

Photo-etched chassis cooling walls

Growing community of inventors

Houston, CA, United States of America

John P Franz