Gould Electronics Inc.

Gould Inc.

Other

John P Callahan

Jiangtao Wang

Dan Lillie

Rolland D Savage

Thomas J Ameen

Chin-Ho Lee

Jamie H Chamberlain

David P Burgess

A portable, easily mountable, temporary exhaust removal system adapted to re-direct exhaust emissions away from an internal combustion engine having an exhaust conduit that exhausts combustion gas from the engine.

Portable exhaust removal system

A composite for use in forming a multi-layer printed circuit board, comprised of an INVAR&reg; sheet having a thickness of between 0.5 mil and 5 mil; and a layer of electrodeposited copper on at least one side thereof. The copper has a thickness of between 1&mgr; and 50&mgr;, wherein the composite has a thermal coefficient of expansion (TCE) of about 2.8 to 6.0 ppm at temperatures between 0&deg; F. and 200&deg; F.

Method of making a copper on INVAR&reg; composite

A sheet material, comprised of a copper foil treated to have a stabilization layer thereon. The stabilization layer is comprised of zinc oxide, chromium oxide or a combination thereof having a thickness between about 5 &angst; and about 70 &angst;. A vapor deposited resistive material is provided on the stabilization layer.

Applying resistive layer onto copper

Method of forming chromium coated copper for printed circuit boards

A conductive copper foil for use in preparing printed circuit boards is protected from damage during storage, shipment and further processing by covering at least one side of the foil with a sheet of plastic film. The film is removably joined with the foil as a result of the essential absence of gaseous material between the film and the foil. Thus, the film conforms intimately to the contours and shape of the foil surface and clings tightly thereto to permit movement and further processing of the foil with the film adhering tightly thereto. The absence of air between the film and the foil is produced by oppositely statically electrically charging the film and the foil such that they are forced together sufficiently to squeeze the air out from therebetween. The film is selected to be sufficiently resistant to laminating temperature and pressure conditions so as to remain in its covering, protecting relationship to the foil and avoid sticking to the laminating press plate and retain its removability from the foil after lamination.

Protected conductive foil assemblage and procedure for preparing same

A conductive copper foil for use in preparing printed circuit boards is protected from damage during storage, shipment and further processing by covering one side of the foil with a sheet of polyethylene film. The film is removably joined with the foil by an adhesive material placed between the film and the foil in a marginal area of the latter. The film is selected to be sufficiently resistant to laminating temperature and pressure conditions so as to remain in its covering, protecting relationship to the foil and avoid sticking to the laminating press plate and retain its removability from the foil after lamination.

Growing community of inventors

Mentor, OH, United States of America

John P Callahan