Xtalic Corporation

Shipley Company LLC

Rohm & Haas Electronic Materials LLC

Rohm and Haas Electronics Materials LLC

John P Cahalen

Alan C Lund

Christopher Allan Schuh

Nazila Dadvand

Daniel J Montville

Jonathan C Trenkle

David W Sherrer

Maria Anna Rzeznik

Wade W Sonnenberg

Rajan Hariharan

John J Fisher

Martin William Bayes

Matthew L Moynihan

Carl J Colangelo

George R Allardyce

Gary Hamm

David L Jacques

Joseph R Montano

Brian D Amos

John E Schemenaur

Peter W Hinkley

Bruno M Sicard

Kevin S Horgan

Peter A Benson

Coated articles and methods for applying coatings are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.

Coated articles

Coated articles and methods

Coated articles and methods for applying coatings are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating may, in some instances, include at least two layers. For example, the coating may include a first layer comprising a silver-based alloy and a second layer comprising a precious metal. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process.

Electrodeposition baths, systems and methods are provided. In some embodiments, the baths, systems and methods are used to deposit metal alloy coatings.

Electrodeposition baths, systems and methods

Silicon containing substrates are coated with nickel. The nickel is coated with a protective layer and the combination is heated to a sufficient temperature to form nickel silicide. The nickel silicide formation may be performed in oxygen containing environments.

Enhanced method of forming nickel silicides

Optical interface assemblies are provided. The optical interface assemblies include a first portion having a plurality of optical waveguides. The first portion is configured for mating engagement with an optical fiber connector. A second portion is mated to the first portion. The second portion is configured for mating engagement with an electronic substrate that includes an embedded waveguide assembly. The first and second portions are further configured so as to align the plurality of optical waveguides, at a first end of the first portion, with a plurality of corresponding waveguide cores of the embedded waveguide assembly. The first and second portions are further configured so as to align the plurality of optical waveguides, at a second end of the first portion, with a plurality of corresponding optical fibers in the optical fiber connector. Also provided are electronic assemblies and methods for coupling optical fibers with electronic substrate embedded waveguides.

Optical interface assembly and method of formation

Structures including a capacitor dielectric material disposed on the surface of an electrode suitable for use in forming capacitors are disclosed. Methods of forming such structures are also disclosed.

Capacitor structure

A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material. The method involves post-treating the micro-roughened conversion coated metal surface with an aqueous organo-silicon wetting composition after having formed the micro-roughened conversion coated metal surface with an adhesion promotion composition. Suitable organo-silicons include organosilanes, organosiloxanes, organosilizanes and the like. The method can be employed in the circuit board industry to improve bonding between layers in multilayer circuit boards.

Process for treating adhesion promoted metal surfaces with an organo-silcon post-treatment

A process and composition for treating a metal surface to increase its surface roughness for subsequent adhesion to a polymer layer. The composition comprises hydrogen peroxide, inorganic acid, an amine free of a surfactant group and optionally, a corrosion inhibitor. The composition is characterized by elimination of a surfactant from solution.

Composition for circuit board manufacture

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Arlington, MA, United States of America

John P Cahalen