John Othniel McDonald

Zach Zimits

A hybrid conductive material comprising at least one conductive material having at least one internal porous insulative layer; and wherein, at least one of the conductive materials fills the voids of the internal porous insulative layer. The hybrid material blends conductive metals and porous insulation layers in a manner so that the resulting material operates as a single layer material with its own unique conductivity and skin depth; and a unique and strong directional impedance. By using a porous insulation layer, metal layers may be bonded together through insulation layers, and this allows rapid low-cost formation of the hybrid material. The hybrid material may be used to form thin wires or traces capable of handling high frequency applications.

Method and apparatus for a novel high-performance conductive metal-based material

The present invention is a spark gap capable of integrating into multiple layer semiconductor substrate packaging. The initial gap in the spark gap is solid and it can be converted into air, meaning gaseous, and the air gap is achieved by having the gap initially be filled with a solid and then running a voltage through the spark gap so that the gap explodes and the solid is replaced by an air cavity. The spark gap may be formed by initially electroplating electrodes through a dry film-based process, and then, to further close the gap between electrodes, beyond the practical limits of dry film, pigtail plating may be used. This pigtail plating may expand the electrodes and thus reduce the gap distance.

Growing community of inventors

Reno, NV, United States of America

John Othniel McDonald