Xircom, Inc.

John N Otey

James G Hughes

Son Nam Doan

A PC card comprising a housing including top and bottom cover panels encloses at least one heat-generating circuit component, typically an IC device or package. A heat spreading element, which may be in the form of a copper sheet, is disposed in conduction heat transfer relationship with the at least one circuit component and at least one of the housing covers, the heat spreading element being adapted to receive heat from the at least one circuit component, to spread the heat uniformly and to transfer it to the at least one housing cover panel. From there, the heat is dissipated into the surrounding environment.

Growing community of inventors

Hidden Hills, CA, United States of America

John N Otey