Dow Global Technolgoies LLC

John N Naumovitz

Teresa Plumley Karjala

Rajen M Patel

Mohamed Esseghir

David T Gillespie

Lori L Kardos

Shaofu Wu

Robert L McGee

Mark T Bernius

Jose Ortega

Michael H Mazor

Lih-Long Chu

Zachary L Polk

Nichole E Nickel

Chuan Yar Lai

A composition comprising an ethylene-based polymer which comprises the following properties: a) MWD(conv) from 3.0 to 7.0; b) an ADF IR between 0.230 and 0.260 for molecular weight &#x2264;15,000 g/mol c) 12 from 4.0 to 6.5 g/10 min.

Ethylene-based polymers with good processability for use in multilayer films

Electronic device module comprising polyolefin copolymer

Multilayer structures useful as a backsheet for an electronic device, e.g., a photovoltaic cell, comprise (A) a top layer comprising a polyolefin resin, e.g., ethylene vinyl acetate, and having a top facial surface and a bottom facial surface, (B) a tie layer comprising an adhesive, e.g., an ethylene glycidyl methacrylate, having a top facial surface and a bottom facial surface, the top facial surface in adhering contact with the bottom facial surface of the top layer, and (C) a bottom layer comprising a polyolefin having at least one melting peak greater than 125&#xb0; C., e.g., a polypropylene, and having a top facial layer and a bottom facial surface, the top facial surface in adhering contact with the bottom facial surface of the tie layer.

Co-extruded, multilayered polyolefin-based backsheet for electronic device modules

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Midland, MI, United States of America

John N Naumovitz