Motorola Corporation

John N Lubbe

Detlef W Schmidt

Lester J Onyszko

Marc H Pullman

Raul Olivera

Jeffrey S Lipschultz

A power amplifier assembly that dissipates a maximum of one thousand one hundred watts includes a power amplifier circuit and a chassis that has an overall volume of 0.02 cubic meters. The chassis includes a heat sink base that contains a mounting pattern for the power amplifier circuit. By thermally coupling the power amplifier circuit to the heat sink base via thermal coupling devices and the mounting pattern, the heat sink base dissipates a maximum of one thousand one hundred watts in a volume of 0.016 cubic meters.

Power amplifier assembly

An apparatus and method (200) for providing a hybrid circuit assembly carrier bracket are included wherein the bracket is constructed and arranged to provide controlled placement of at least a first power transistor (124, 126) and to provide a highly efficient thermal transfer and dissipating arrangement. The bracket is constructed and arranged to provide for placement of at least a first substrate for a hybrid circuit assembly thereon, and includes at least a first power transistor aperture (120, 122) with at least two bracket projections (146, 148) for permitting placement of said transistor on plural electrical contacts (104, 106). The heat generated by components on the circuit board(s) is transferred and dissipated substantially by biasing at least one bracket projection member resiliently against a heat sink (108, 110, 112, 114, 116, 118).

Method for providing novel hybrid circuit assembly carrier bracket

A first heat sink member with extension slots and component detailing is cast from a thermally conductive material. Fin members are constructed from a similar, but not necessarily identical, thermally conductive material. The fin members are constructed so that they will mate with the extension slots of the first heat sink member. Positioned in alignment with the extension slots to the first heat sink member, the fin members are attached with a thermally conductive bonding agent.

Method and apparatus of an improved heat sink

Method and apparatus for providing novel hybrid circuit assembly carrier

Electronic equipment power amplifier module

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Chicago, IL, United States of America

John N Lubbe