Delco Electronics Corporation

Delphi Technologies, Inc.

John Michael Matly

Chris Ralph Snider

Vineet Gupta

Michael G Coady

Timothy Dean Garner

Curtis Allen Stapert

Joseph K Huntzinger

Allen E Oberlin

Jeffrey T Bell

Robert L Vadas

Kevin Earl Meyer

Jerry Wendling

Donald G Moeschberger

John M Hart, Jr

Kip R Piel

Edgar Glenn Hassler

Michael E Fye

Dan Darryl Carman

Russell B Hopkins

Lewis Henry Little

Tim A Kenworthy

Paul A Uglum

Rick L Hatcher

Quan N Nguyen

Philip M Scott

Paul C Burton

William R Reed

Gary L Stahl

Janet S Dawson

Kevin E Meyer

Jerry J Wendling

Gerald J Wendling

Thimothy D Garner

A lightweight radio/CD player for vehicular application is virtually 'fastenerless' and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting 'slide lock' and &#x201c;snap lock&#x201d; self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.

Lightweight audio system for automotive applications and method

A pressure sensor suitable for sensing low pressure environments. The pressure sensor includes a piezoresistive sensing element enclosed within a protective housing, and utilizes an insert molded into the housing for supporting the sensing element and concentrating stresses within the housing at a maximum distance from the sensing element. The insert is adapted to work in cooperation with a constraint to isolate the sensing element from stresses within the housing, so as to improve the electrical performance of the sensing element to low pressure environments, such as an evaporative emission system of an automobile.

Pressure sensor having reduced hysteresis and enhanced electrical

A carrier frame has cells with inwardly extending thin flexible tabs. Pressure sensor housings are molded into the frame cells such that only the tips of the tabs penetrate the housing wall and after processing the housings are readily pushed out of the frame. A lead frame is insert molded at the same time. During molding the cells of the frame are open ended and after molding a reinforcing tie bar is attached across the open side of the frame to close the cells. A flange is bent up on the opposite side to lend rigidity to the frame. Preformed code flags are provided in the frame and selectively bent out for coding.

Method of manufacturing a pressure sensor assembly

Apparatus useful in the manufacture of a pressure sensor assembly

A pressure sensor assembly is provided containing a substrate having signal conditioning circuitry disposed on both surfaces of the substrate, with the critical pressure sensing element disposed on one surface of the substrate and the laser trimmable resistors disposed on the other surface of the substrate. The preferred ported housing of this invention seals the one side of the substrate containing the pressure sensing element thereby forming a pressurizable chamber, while allowing the signal conditioning circuitry and resistors on the other surface exposed for calibration by laser trimming of the resistors. This eliminates the requirement for a separate housing for the critical pressure sensing element. In addition, when the preferred ported housing is mounted to the pressure sensing side of the substrate for formation of the sealed pressure chamber, the through-holes which electrically interconnect the signal processing circuitry on both sides of the substrate are also concurrently sealed.

Pressurer sensor and method for assembly of same

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Kokomo, IN, United States of America

John Michael Matly