Raytheon Company

Texas Instruments Corporation

John Michael Bedinger

Michael A Moore

Thomas E Kazior

Robert B Hallock

Clyde R Fuller

James Stephen Mason

Kamal Tabatabaie Alavi

Ralph E Williams

Dan T Hockersmith

Larry G Barnett

Rick Kottman

Sankerlingam Rajendran

Kamal Tabatabaie

Kamal Tabatabaie-Alavi

Thomas H Taylor

Brad W Larson

David B Rhine

Raj Rajendran

Steve Pebley

Waid A Paine

Thomas A Hanft

James S Mason

A low permeability laminate film includes one or more low moisture permeability homogeneous polymer films with a total thickness between 0.5 and ten mils without glass or ceramic fillers and with a moisture permeability measured at 37&#xb0; C. and 100% RH of less than 2.6 E-05 atm&#xb7;cc&#xb7;mm/in&#xb7;sec of air. The polymer film includes one of polychlorotrifluoroethylene, polytetrafluorethylene, fluorinated ethylene propylene, and perfluoro alkoxy alkane. The low permeability laminate film further includes a nanolaminate including alternate combinations of nanolaminate material that is selected from the group consisting of alumina, titanium dioxide, zirconium oxide, beryllium oxide, hafnium oxide, titanium oxide, silicon nitride, tantalum nitride, silica, parylene F, parylene AF-4, parylene HT&#xae; and PTFE (polytetrafluoroethylene). A resulting coated nanolaminate film has a moisture permeability less than an equivalent standard leak rate per square inch of 3.0 E-08 atm&#xb7;cc/in&#xb7;sec of air.

Hermetic chip on board

An electronic device includes: a water impermeable substrate; at least one electronic circuit on the water impermeable substrate; a dielectric encapsulant on the electronic circuit; a capping layer comprising a polymer on the dielectric encapsulant; and a barrier layer on the capping layer, the water impermeable substrate, the dielectric encapsulant, the capping layer, and the barrier layer forming a hermetically sealed micro-cavity.

Electronic device including hermetic micro-cavity and methods of preparing the same

A stacked stripline circulator includes a first ferrite disc, a second ferrite disc, a first substrate having a metalized edge with the first ferrite disc disposed in the first substrate, a second substrate having a metalized edge with the second ferrite disc disposed in the second substrate, a first metalized pattern defining ports of a circulator disposed on the first substrate, the first metalized pattern comprising copper, a second metalized pattern defining ports of a circulator disposed on the second substrate, the second metalized pattern comprising copper, and a bonding ring bonding the metalized edge of the first substrate with the metalized edge of the second substrate.

Stacked low loss stripline circulator

A radome is provided and includes a substrate formed of moisture permeable material and a coating disposed on a surface of the SCFS substrate. The coating includes a layer of inorganic material disposed adjacent to at least one layer of organic material.

Radome film

A method includes providing a circuit board having an outer surface, the outer surface configured with a plurality of discrete electrical components that are each manufactured independently of one another, and coating the outer surface and the plurality of discrete electrical components with a first protective dielectric layer. The method further includes coating the first protective dielectric layer with a second dielectric layer. The second dielectric layer includes a dielectric material having a modulus of elasticity less than 3.5 Giga-Pascal (GPa), a dielectric constant less than 2.7, a dielectric loss less than 0.002, a breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), a temperature stability to 3000 Celsius, a defect densities less than 0.5/centimeter, a pinhole free in films greater than 50 Angstroms, and is capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 10%.

Methods of making an environment protection coating system

According to one embodiment of the disclosure, a method for passivating a circuit device generally includes providing a substrate having a substrate surface, forming an electrical component on the substrate surface, and coating the substrate surface and the electrical component with a first protective dielectric layer. The first protective dielectric layer is made of a generally moisture insoluble material having a moisture permeability less than 0.01 gram/meter/day, a moisture absorption less than 0.04 percent, a dielectric constant less than 10, a dielectric loss less than 0.005, a breakdown voltage strength greater than 8 million volts/centimeter, a sheet resistivity greater than 10ohm-centimeter, and a defect density less than 0.5/centimeter.

Passivation layer for a circuit device and method of manufacture

A circuit board assembly includes a circuit board having an outer surface, the outer surface being configured with a plurality of discrete electrical components that are each manufactured independently of one another. The circuit board assembly further includes a domed lid enclosure disposed over one of the plurality of discrete electrical components and an additional dielectric coating overlying the outer surface and the domed lid enclosure.

Environmental protection coating system and method

According to one embodiment of the disclosure, an environmental protection coating comprises a circuit assembly having a first protective dielectric layer and a second dielectric layer. The circuit assembly has an outer surface on which a plurality of discrete electrical components are attached. The first protective dielectric layer overlays the circuit assembly. The second dielectric layer overlays the first protective dielectric layer and is made of a dielectric material having modulus of elasticity less than 3.5 Giga-Pascal (GPa), dielectric constant less than 2.7, dielectric loss less than 0.008, breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), temperature stability to 300&#xb0; Celsius, defect densities less than 0.5/centimeter, pinhole free in films greater than 50 Angstroms, capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 10%.

A circuit board assembly includes a circuit board having an outer surface configured with a plurality of discrete electrical components. The assembly includes a first protective dielectric layer overlying the outer surface, and a second dielectric layer overlying the first protective dielectric layer and the discrete electrical components. The second dielectric layer includes a dielectric material having modulus of elasticity less than 3.5 Giga-Pascal (GPa), a dielectric constant less than 3.0, a dielectric loss less than 0.008, a moisture absorption less than 0.04 percent, a breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), a temperature stability to 300&#xb0; Celsius, pinhole free in films greater than 50 Angstroms, hydrophobic with a wetting angle greater than 45 degrees, capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 30%.

According to one embodiment of the present invention, a microwave or millimeter wave module includes a dielectric layer having a pocket formed substantially through the dielectric layer. The dielectric is attached to a metal substrate. The pocket has substantially vertical sidewalls. An integrated circuit is disposed in the pocket. Opposing sides of the integrated circuit are substantially parallel to the sidewalls of the pocket. An interconnect electrically couples the integrated circuit to a bond pad disposed on the outer surface of the dielectric layer. The interconnect has a length that is minimized to result in reduced inductance of the semiconductor device.

Reduced inductance interconnect for enhanced microwave and millimeter-wave systems

A method, system and materials for use in hydrogen gettering in conjunction with microelectronic and microwave components that are generally hermetically sealed in an enclosure typically referred to as a 'package'. Gettering materials that can be used include titanium with or without a hydrogen permeable coating or covering, alloys of zirconium-vanadium iron and zeolites and several ways to apply these materials to the package. In addition, the hydrogen permeable material can be used over a vent from the interior of the package to the exterior wherein hydrogen will escape from the package interior when the hydrogen concentration within the package is greater than without the package.

Growing community of inventors

Garland, TX, United States of America

John Michael Bedinger