Kla Tencor Corporation

Kla-Tencor Technologies Corporation

Kla Corporation

John McCormack

Lei Zhong

Jian Shen

Carlos L Ygartua

Ningqi Zhu

Robert J McClelland

Yanfei Sun

A system for estimating front side overlay on a sample based on shape data is disclosed. The system includes a characterization sub-system and a controller. The controller includes one or more processors configured to: generate a vacuum hole map of a vacuum chuck; generate a vacuum force distribution across a sample based on the generated vacuum hole map of the vacuum chuck; determine shape data of the sample based on the vacuum force distribution and an identified relationship between backside surface roughness and vacuum force of the vacuum chuck; and convert the shape data of the sample to an overlay value of a frontside surface of the sample.

System and method for converting backside surface roughness to frontside overlay

A method and device for facilitating measurement of thermo-optically induced material phase change response in a thin planar or a grating film stack is disclosed. The method may include using small-spot visible and ultraviolet spectra (ellipsometric or reflectance) for measuring a material phase change response. The device may include a measurement system platform, at least one electrical resistor, at least one external electric probe, and ohmic contact circuitry.

Method for measuring thermo-optically induced material phase-change response in a multiple layer thin film structure using visible and ultraviolet spectroscopy

Computer-implemented methods, carrier media, and systems for detecting defects on a wafer based on multi-core architecture are provided. One computer-implemented method for detecting defects on a wafer includes acquiring output for the wafer generated by an inspection system. Dies are formed on the wafer, and multiple cores are formed in the dies. The method also includes detecting defects on the wafer by comparing the output for a first of the multiple cores to the output for a second of the multiple cores. The first and second of the multiple cores are formed in the same die, different dies, or the same die and different dies.

Computer-implemented methods, carrier media, and systems for detecting defects on a wafer based on multi-core architecture

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Linlithgow, United Kingdom

John McCormack