Cisco Technology, Inc.

Sioptical, Inc.

Cewa Technologies Inc.

John Matthew Fangman

Vipulkumar K Patel

Mary Nadeau

Prakash B Gothoskar

Mark Andrew Webster

Utpal Kumar Chakrabarti

Ravinder Kachru

Stefan Pfnuer

Michael Everett Fangman

John Stewart Fangman

Ravi Kachru

Sudhakar Neti

Arati Shah-Yukich

Kishor V Desai

Kalpendu Shastri

Soham Pathak

Robert Keith Montgomery

Margaret Ghiron

David Piede

Craig Young

Duane Stackhouse

John Fangman

A method of manufacturing an optical communication device includes preparing first and second pre-defined break lines in a carrier wafer. A first sub-mount is positioned near the first break line to accommodate an optical laser and a second sub-mount is positioned near the second break line to accommodate an optical modulator. The first sub-mount is secured to a thermally conductive and electrically nonconductive spacer which is secured to a thermo-electrical cooler that defines a gap between the first submount and the thermo-electrical cooler. A portion of the carrier wafer between the sub-mounts is removed.

Method for manufacturing an optical communication device

An arrangement for improving adhesive attachment of micro-components in an assembly utilizes a plurality of parallel-disposed slots formed in the top surface of the substrate used to support the micro-components. The slots are used to control the flow and 'shape' of an adhesive 'dot' so as to quickly and accurately attach a micro-component to the surface of a substrate. The slots are formed (preferably, etched) in the surface of the substrate in a manner that lends itself to reproducible accuracy from one substrate to another. Other slots (&#x201c;channels&#x201d;) may be formed in conjunction with the bonding slots so that extraneous adhesive material will flow into these channels and not spread into unwanted areas.

Slotted configuration for optimized placement of micro-components using adhesive bonding

A method of manufacturing an optical communication device aligns an optical sub-assembly and an optical modulator on a carrier wafer. A first sub-mount supports the optical sub-assembly and a second sub-mount supports the optical modulator. Pre-defined break lines are placed on the carrier wafer to accommodate separation of the sub-assembly and the optical modulator. The first sub-mount connects the optical sub-assembly to a thermoelectric cooler by either an epoxy, a spacer layer, or both. The optical sub-assembly is aligned in the x/y/z directions relative to the second sub-mount in a position to match an optical height of the optical modulator in the z-direction, wherein the z-direction is a vertical direction relative to the carrier wafer.

A solar concentrator comprises a pair of concentric reflectors having a spindle toroid geometry for focusing the collected solar radiation into a ring-shaped focal area, as opposed to the 'point' or 'line' focus of prior art configurations. In a preferred embodiment, each reflector is formed of a plurality of curved petals that are disposed in a contiguous, keystone arrangement that requires no additional fixturing to hold the petals in place. Such an arrangement reduces the weight, complexity and cost of the final solar concentrator structure.

Solar concentrator configuration with improved manufacturability and efficiency

An silicon-on-insulator (SOI)-based photonics platform is formed to including a venting structure for encapsulating the active and passive optical components formed on the SOI-based photonics platform. The venting structure is used to allow for the encapsulated components to 'breathe' such that water vapor and gasses will pass through the package and not condensate on any of the encapsulated optical surfaces. The venting structure is configured to also to prevent dust, liquids and other particulate material from entering the package.

Vent structures for encapsulated components on an SOI-based photonics platform

An opto-electronic apparatus comprises a substrate for supporting a plurality of components forming an opto-electronic assembly and an optical component attached to the substrate with an adhesive material, such as a solder or epoxy. The optical component is formed to include a plurality of bond slots disposed in parallel across at least a portion of the bottom surface of the optical component, the plurality of bond slots providing a path for a liquid adhesive material and improving the ability to displace the liquid adhesive material as the component is pressed into the surface of the substrate during the attachment process.

Optical components including bonding slots for adhesion stability

An apparatus for providing releasable attachment between a fiber connector and an opto-electronic assembly, the opto-electronic assembly utilizing an interposer substrate to support a plurality of opto-electronic components that generates optical output signals and receives optical input signals. An enclosure is used to cover the interposer substrate and includes a transparent region through which the optical output and input signals pass unimpeded. A magnetic connector component is attached to the lid and positioned to surround the transparent region, with a fiber connector for supporting one or more optical fibers magnetically attached to the connector component by virtue of a metallic component contained in the fiber connector. This arrangement provides releasable attachment of the fiber connector to the enclosure in a manner where the optical output and input signals align with the optical fibers in the connector.

Releasable fiber connector for opto-electronic assemblies

An arrangement for providing optical coupling into and out of a relatively thin silicon waveguide formed in the SOI layer of an SOI structure includes a lensing element and a defined reference surface within the SOI structure for providing optical coupling in an efficient manner. The input to the waveguide may come from an optical fiber or an optical transmitting device (laser). A similar coupling arrangement may be used between a thin silicon waveguide and an output fiber (either single mode fiber or multimode fiber).

Wideband optical coupling into thin SOI CMOS photonic integrated circuit

An arrangement for providing passive alignment between an optical fiber and the 'tip' of a nanotaper coupling waveguide (the nanotaper formed within the SOI layer of an SOI-based optoelectronic arrangement). The arrangement includes a separate fiber carrier support element, including a longitudinal V-groove for supporting the fiber and an alignment feature formed parallel thereto. The SOI structure is formed to include an associated alignment slot, so that as the fiber carrier is positioned over and attached to the SOI structure, the alignment feature and alignment slot will mate together and provide passive alignment of the optical fiber to the nanotaper waveguide tip.

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Reading, PA, United States of America

John Matthew Fangman