Sharp Kabushiki Kaisha Corporation

Sharp Microelectronics Technology, Inc.

John Martin Grant

Lynn R Allen

Methods and equipment for anisotropic, patterned conversion of copper into selectively removable compounds and for removal of the same are disclosed. In one embodiment a plasma reactor is used to anisotropically convert unmasked portions of a copper layer at low temperature into copper chloride. The copper chloride is removed by one or more of the following steps: (1) solvation by a solvent specific to the copper chloride; (2) vaporizing the copper chloride away; and (3) converting the copper chloride into a volatile, secondary compound. In another embodiment an ion implanter is used to anisotropically convert desired portions of a copper layer into copper oxide. The copper oxide is removed by one or more of the following steps: (1) solvation by a solvent specific to the copper oxide; (2) vaporizing the copper oxide away; and (3) converting the copper oxide into a volatile, secondary compound.

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Vancouver, WA, United States of America

John Martin Grant