Intel Corporation

John Mark Matson

Thomas P Thomas

Robert J Munoz

Kursad Kiziloglu

Michael C Rifani

Embodiments may relate to a substrate for use in a system in package (SIP). The substrate may include a first couple to couple with a first component via a permanent couple such that the first component is communicatively coupled with a bridge. The substrate may further include a second couple to removably couple with an interposer such that the interposer is communicatively coupled with the bridge via a communicative couple. Other embodiments may be described or claimed.

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Portland, OR, United States of America

John Mark Matson