Delco Electronics Corporation

Delphi Technologies, Inc.

Delphi Technologies IP Limited

Borgwarner US Technologies LLC

Delco Electronics Corporaiton

Delphi Automative Systems Luxembourg Sa

John Mark Dikeman

Mark Wendell Gose

Jack L Glenn

Alireza F Borzabadi

Michael B Thoeny

Kevin M Gertiser

Peter Allan Laubenstein

William David Higdon

Douglas Bruce Osborn

Frank Stepniak

Mario D Nemirovsky

Jerry W Campbell

Pankaj Mithal

Daniel C Penrod

Clinton W Erickson

Felix Mandoux

Troy D Clear

Soumyajit Routh

Lokesh Gona

Gregory M Hutchinson

Fereydoon Dadkhah

Curtis N Kell

R Clark Griffin

Mitchell S Cohen

A system for a direct-current (DC) to alternating current (AC) inverter includes: a memory configured to store instructions; a main microcontroller configured to execute the stored instructions to control the inverter during non-timing-critical operation; and a safety controller configured to control the inverter during timing-critical operation.

Configurable fault and control safety architecture for inverter system

A system for controlling the operation of one or more fuel injectors includes a microcontroller, a pre-driver unit, and a power unit. The system is connectable to an electrically actuated fuel injector via at least two wires from the power unit, wherein the pre-driver unit is located between the microcontroller and the power stage, and wherein the microcontroller unit is adapted to send data to the pre-driver unit. The pre-driver unit is adapted to receive the data and control the power stage dependent on the data such that the power stage is adapted to output a corresponding signal along the wires to the fuel injector. The data includes both injector activation pulse data and other auxiliary data for the injectors.

Arrangement to transmit data from an ECU to a fuel injector

A method includes, responsive to an application of power to an IC, self-initializing the IC by asserting a reset signal for a reset period. Self-initializing the IC also includes, in response to an expiration of the reset period, deasserting the reset signal. Self-initializing the IC also includes, responsive to deasserting the reset signal, automatically obtaining first temperature data from at least one thermal sensing device associated with a die of the IC, and storing the first temperature data in a storage component of the IC.

Integrated circuit and method for capturing baseline die temperature data

An illustrative embodiment of a fuel injector control system includes a driver that is configured to supply electrical power to a fuel injector. A controller is configured to control the driver by implementing a predetermined sequence of a plurality of states for an injection cycle. The plurality of states each include parameters for supplying electrical power to the fuel injector. The controller selects one of the states to implement as a next one of the states in the sequence based on a characteristic of an activation signal and information indicative of the state corresponding to the characteristic of the activation signal.

Fuel injector control including state selection based on a control signal characteristic

An illustrative embodiment of a fuel injector control system includes a driver that is configured to supply electrical power to a fuel injector. A controller is configured to control the driver according to a predetermined sequence of states for an injection cycle. The plurality of predefined states each include parameters for supplying electrical power to a fuel injector. Each of the states has a corresponding plurality of test parameters. At least one of the test parameters is a target parameter for the state. During each of the states, the controller determines whether at least one of the test parameters is met and determines how to control the driver for a subsequent portion of the injection cycle based on which of the test parameters is met.

Fuel injector control including adaptive response

The present invention includes a method for performing a thermal analysis, including the steps of determining size and placement of each of a plurality of drivers on an integrated circuit device. The determined size and placement of each driver is stored as layout data and the layout data is converted into input for a finite element analysis program. The input is applied to the finite element analysis program, and the finite element analysis program is used to construct a finite element mesh of the integrated circuit device from the input. Additionally, material properties are assigned to the finite element mesh, and a thermal analysis is performed of the finite element mesh to generate data in a thermal analysis report.

Method for automatic generation of finite element mesh from IC layout data

A protection device for handling energy transients includes a plurality of basic unit Zener diodes connected in series to achieve a desired breakdown voltage. Each of the basic unit Zener diodes is formed in a first-type substrate. Each of the basic unit Zener diodes comprises a second-type well formed in the substrate, a second-type Zener region formed in the second-type well and a first-type+ region formed over the second-type Zener region between a first and second second-type+ region.

Protection device for handling energy transients

A metal runner that improves the current-carrying capability of solder bumps used to electrically connect a surface-mount circuit device to a substrate. The runner comprises at least one leg portion and a pad portion, with the pad portion having a continuous region and a plurality of separate electrical paths leading to and from the continuous region. The electrical paths are delineated in the pad portion by nonconductive regions defined in the pad portion, with at least some of the nonconductive regions extending into the leg portion. The multiple electrical paths split the current flow to and from the solder bump, distributing the current around the perimeter of the solder bump in a manner that reduces current density in regions of the solder bump where electromigration is most likely.

Flip-chip interconnected with increased current-carrying capability

A transient suppressor comprises a self-triggered silicon control rectifier (SCR) that forms a drive circuit for an NPN power transistor. The SCR and the NPN power transistor are combined, along with other elements, into an integrated circuit (IC) by a junction isolated BiCMOS process. The SCR self-triggers upon being subjected to an inductive flyback condition created by an inductive load and renders the NPN transistor conductive, thereby allowing the NPN power transistor, having a relatively large semiconductor region, to effectively snub the current created by the negative feedback condition. The transient suppressor may be used in either a high-side or low-side driver arrangement and the SCR/NPN power transistor combination may further be combined with load driving and other circuitry on a single integrated circuit. The IC is designed to perform normally when subjected to transient conditions and further when there exists a potential voltage differential between the circuit ground and the load ground of at least 2 volts.

Integrated inductive load snubbing device

Circuitry for controlling load current, in accordance with the present invention, utilizes a load drive transistor configuration operable to provide a first load current path having a first fraction of load current flowing therethrough and a second load current path having a second smaller fraction of load current flowing therethrough. The circuit includes a sense resistor associated with the load drive transistor to detect various load current threshold values. In order to reduce debiasing effects of the sense resistor upon the second load current path of the load drive transistor, a compensation resistor is provided between drive inputs associated with each of the two current paths. The compensation resistor has a compensation voltage established thereacross which is operable to negate the debiasing effect of the sense resistor on the load driving device.

Circuitry for controlling load current

Integrated inductive load snubbing device using a multi-collector

An integrated pulse-width modulation circuit with conditional temperature protection circuitry includes logic circuitry, a power output device, thermal shutdown circuitry to disable the power output device when the die temperature exceeds a predetermined limit, and a masking circuit that disables the thermal shutdown circuit during short term thermal increases such as those that occur when an inductive load turn off event takes place.

Integrated pulse-width modulation circuit with thermal shutdown circuit

A glass envelope contains a silicon substrate which embodies an active matrix anode array, a microprocessor, and anode driving circuits. A small number of pins on the envelope couple display parameters and control signals to the microprocessor, and logic and anode signal voltages are supplied to the substrate. The microprocessor determines which pixels in the anode array should be energized and the driving circuit addresses the array and applies energizing voltage to the selected pixels. The driving circuit is supplied by the low signal voltage and includes a voltage level shifting function to increase the level by an order of magnitude to realize a voltage high enough for adequate display brightness. The display can be made small due to the small number of pins required.

Active matrix vacuum fluorescent display with microprocessor integration

A single glass envelope contains fixed anode segments on the glass surface and a silicon substrate mounted on the same surface. The silicon substrate contains an active matrix vacuum fluorescent anode array as well as serial interface circuitry and a driver circuit for each of the AMVFD and the fixed segment display to minimize the number of input pins in the lead frame of the envelope. Aluminum traces on the glass surface are wire bonded to the substrate and extend to the fixed segments and to the lead frame pins.

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Kokomo, IN, United States of America

John Mark Dikeman