Wstp, LLC

Other

Spheretek, LLC

John MacKay

Tom Molinaro

Evan Parker

Bruce Hammond

An ordnance usable against a living body, the ordnance having a tracking module with a transmitter that can use at least a portion of the body as an antenna. In preferred embodiments, the tracking module is releasably coupled to a carrier, and a pointed tip is disposed on at least one of the tracking module and the carrier. The module preferably includes a circuit that provides location information to the transmitter, and optionally provides additional information, including at least one of motion, compass, pressure, oxygen, and heart beat information. Transmission can occur at any suitable interval, including for example, at least three times during a ten minute period. The transmitter can optionally transmit a no heart beat signal, failure signal, and/or low battery signal. Preferred systems include a receiver that can send an interrogation signal, and the ordnance can include an interrogation receiving circuit for receiving interrogation signals.

Electronic tracking system

A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic component; and removing the sacrificial substrate. The transfer substrate may comprise a sacrificial film and a metal layer patterned with a mask which is used to form solder balls on the transfer substrate. Or, the transfer substrate may comprise a sheet of material having solder balls embedded at least partially in the sheet. A method of aligning a part being bumped with a transfer substrate, using a shuttle mechanism and an alignment film is disclosed.

Bumping electronic components using transfer substrates

A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.

Forming solder balls on substrates

A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic component; and removing the sacrificial substrate. The transfer substrate may comprise a sacrificial film and a metal layer patterned with a mask which is used to form solder balls on the transfer substrate. Or, the transfer substrate may comprise a sheet of silicone rubber having solder balls embedded at least partially in the sheet. A method of aligning a part being bumped with a transfer substrate, using a shuttle mechanism and an alignment film is disclosed.

A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A method for printing the mask with solder paste is described.

Ball bumping substrates, particuarly wafers

A mask (,; see also,) having a plurality of openings (cells) is disposed on, or nearly on, the surface of a substrate (,), the openings (,) of the mask being aligned over a corresponding plurality of pads (,) on the substrate. The openings in the mask are filled with solder material (,). A pressure plate (,) is disposed over the mask to capture the solder material in the cells. Heat is directed at the mask (through the pressure plate) to reflow the solder. This is done in an inverted or partially inverted orientation. The stackup (assembly) of substrate/mask/pressure plate may be un-inverted prior to cooling. Mask configurations, methods of mounting the masks, and solder material compositions are described. The methods are robust, and are well suited to fine pitch as well as coarse pitch ball bumping of substrates.

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San Jose, CA, United States of America

John MacKay