International Business Machines Corporation

Endicott Interconnect Technologies, Inc.

Other

I3 Electronics, Inc.

John M Lauffer

Voya Rista Markovich

Rabindra N Das

David John Russell

Bernd Karl Appelt

William E Wilson

How Tzu Lin

Konstantinos I Papathomas

David L Thomas

James W Fuller, Jr

Frank Daniel Egitto

Kostas I Papathomas

Benson Chan

Roy H Magnuson

Richard A Schumacher

James M Larnerd

Peter A Moschak

Robert Maynard Japp

Ross William Keesler

Christina Marie Boyko

James J McNamara, Jr

Subahu Dhirubhai Desai

Michael A Gaynes

Bruce John Chamberlin

Thomas R Miller

James Robert Wilcox

Irving Memis

John A Welsh

Issa S Mahmoud

Saswati Datta

Burtran Joe Cayson

Irv Memis

Anilkumar Chinuprasad Bhatt

John Steven Kresge

Miguel Angel Jimarez

Kenneth Michael Fallon

Joseph Duane Kulesza

James R Stack

Marybeth Perrino

Joseph Gene Sabia

Roy Lynn Arldt

Jim P Paoletti

Donald O Anstrom

James Francis Muska

Philip Chihchau Liu

Richard Michael Kozlowski

Issa Said Mahmoud, Deceased

Donald Seton Farquhar

Douglas Oliver Powell

Michael Wozniak

James Jens Hansen

Mark David Poliks

William John Rudik

Gary A Johansson

Ashwinkumar C Bhatt

Donald Herman Glatzel

Stephen Joseph Fuerniss

Joseph G Hoffarth

Heike Marcello

Michael D Lowell

Sylvia Adae-Amoakoh

Kathleen L Covert

Joseph J Sniezek

Steven G Rosser

Joseph P Resavy

Ronnie Charles McHatton

Corey Seastrand

James W Orband

William Louis Brodsky

Luis Jesus Matienzo

Gerald Walter Jones

Robin A Susko

Kostantinos I Papathomas

Chi Shih Chang

Andrew Michael Seman

Kim Joseph Blackwell

Kevin Taylor Knadle

Michael Joseph Johnson

Ronald A Kaschak

Norman A Card

Bernd Karl-Heinz Appelt

Ronald Verne Smith

John E Kozol

Cheryl L Palomaki

Steven A Duncan

Stephen Krasniak

John A Covert

Joseph Hromek

Richard C Senger

Craig Neal Johnston

David K Balkin

Thomas J Davis

Kathleen L Covert, Deceased

James P Paoletti

Magan S Patel

Lawrence C Alexander

James T Matthews

Vova R Markovich

A multilayer capable electrically conductive adhesive (ECA) mixture for connecting multilevel Z-axis interconnects and a method of forming the ECA for connecting multilevel Z-axis interconnects. The multilayer capable ECA contains a mixture of constituent components that allow the paste to be adapted to specific requirements wherein the method of making a circuitized substrate assembly in which two or more subassemblies having potentially disparate coefficients of thermal expansion (CTE) are aligned and Z-axis interconnection are created during bonding. The metallurgies of the conductors, and those of a multilayer capable conductive paste, are effectively mixed and the flowable interim dielectric used between the mating subassemblies flows to engage and surround the conductor coupling.

Electrically conductive adhesive (ECA) for multilayer device interconnects

A method of making a circuitized substrate which includes at least one and possibly several capacitors as part thereof. In one embodiment, the substrate is produced by forming a layer of capacitive dielectric material on a dielectric layer and thereafter forming channels with the capacitive material, e.g., using a laser. The channels are then filled with conductive material, e.g., copper, using selected deposition techniques, e.g., sputtering, electro-less plating and electroplating. A second dielectric layer is then formed atop the capacitor and a capacitor 'core' results. This 'core' may then be combined with other dielectric and conductive layers to form a larger, multilayered PCB or chip carrier. In an alternative approach, the capacitive dielectric material may be photo-imageable, with the channels being formed using conventional exposure and development processing known in the art.

Substrate having internal capacitor and method of making same

A circuitized substrate in which three conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to two dielectric layers. Each of the foil surfaces which physically bond to a respective dielectric layer are smooth (e.g., preferably by chemical processing) and may include a thin, organic layer thereon. One of the conductive layers may function as a ground or voltage (power) plane while the other two may function as signal planes with a plurality of individual signal lines as part thereof. An electrical assembly and an information handling system utilizing such a circuitized substrate are also provided, as is a method of making the substrate.

Circuitized substrate utilizing three smooth-sided conductive layers as part thereof and electrical assemblies and information handling systems utilizing same

Methods of forming embedded, multilayer capacitors in printed circuit boards wherein copper or other electrically conductive channels are formed on a dielectric substrate. The channels may be preformed using etching or deposition techniques. A photoimageable dielectric is an upper surface of the laminate. Exposing and etching the photoimageable dielectric exposes the space between the copper traces. These spaces are then filled with a capacitor material. Finally, copper is either laminated or deposited atop the structure. This upper copper layer is then etched to provide electrical interconnections to the capacitor elements. Traces may be formed to a height to meet a plane defining the upper surface of the dielectric substrate or thin traces may be formed on the remaining dielectric surface and a secondary copper plating process is utilized to raise the height of the traces.

Method of forming multilayer capacitors in a printed circuit substrate

A circuitized substrate and method of making same in which quantities of thru-holes are formed within a dielectric interposer layer. The substrate includes two printed circuit board (PCB) layers bonded to opposing sides of the interposer with electrically conductive features of each PCB aligned with the interposer thru-holes. Resistive paste is positioned on the conductive features located adjacent the thru-holes to form controlled electrically resistive connections between conductive features of the two PCBs. A circuitized substrate assembly and method of making same are also disclosed.

Circuitized substrate with dielectric interposer assembly and method

A method of making a circuitized substrate including a resistor comprised of material which includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a ferroelectric ceramic and/or a high surface area ceramic and/or a transparent oxide and/or a dope manganite. Alternatively, the material will include the polymer resin and nano-powders, with the nano-powders comprising at least one metal coated ceramic and/or at least one oxide coated metal component. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) utilizing such a circuitized substrate are also provided.

Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate

A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically bond to the dielectric are smooth (e.g., preferably by chemical processing) and include a thin, organic layer thereon, while the outer surfaces of both foils are also smooth (e.g., preferably also using a chemical processing step). One of these resulting conductive layers may function as a ground or voltage plane while the other may function as a signal plane with a plurality of individual signal lines as part thereof. An electrical assembly and an information handling system utilizing such a circuitized substrate are also provided.

Circuitized substrates utilizing smooth-sided conductive layers as part thereof

A method of making a circuitized substrate which involves forming a plurality of individual film resistors having approximate resistance values as part of at least one circuit of the substrate, measuring the resistance of a representative (sample) resistor to define its resistance, utilizing these measurements to determine the corresponding precise width of other, remaining film resistors located in a defined proximity relative to the representative resistor such that these remaining film resistors will include a defined resistance value, and then selectively isolating defined portions of the resistive material of these remaining film resistors while simultaneously defining the precise width of the resistive material in order that these film resistors will possess the defined resistance.

Method of making circuitized substrates having film resistors as part thereof

A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser.

Multi-layer embedded capacitance and resistance substrate core

Apparatus and method for making circuitized substrates using a continuous roll format in which a layer of conductor is fed into the apparatus, layers of photo-imageable dielectric are applied to opposite sides of the conductor layer, thru-holes are formed through the composite, and then metal layers are added over the dielectric and then patterns (e.g., circuit) are formed therein. Several operations are performed in addition to these to form the final end product, a circuitized substrate (e.g., printed circuit board), all while the conductor layer of the product is retained in a solid format, up to the final separation from the continuous layer.

Method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner

A capacitive substrate and method of making same in which first and second glass layers are used. A first conductor is formed on a first of the glass layers and a capacitive dielectric material is positioned over the conductor. The second conductor is then positioned on the capacitive dielectric and the second glass layer positioned over the second conductor. Conductive thru-holes are formed to couple to the first and second conductors, respectively, such that the conductors and capacitive dielectric material form a capacitor when the capacitive substrate is in operation.

Capacitive substrate

Method of making circuitized substrate with a resistor

An LED lighting assembly including a plurality of individual LEDs mounted on a common, bendable heat sinking member designed to remove heat from the LEDs during operation and also to be formed (bent) to provide the desired light direction and intensity. Several such assemblies may be used within an LED lamp, as also provided herein. The lamp is ideal for use within medical and dental environments to assure optimal light onto a patient located at a specified distance from the lamp.

LED lighting assembly and lamp utilizing same

Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner

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Waverly, NY, United States of America

John M Lauffer