Fsi International, Inc.

Soligie, Inc.

Molex Corporation

John M Heitzinger

Robert T Fayfield

David G Sime

Matthew P Timm

Jeffrey T Griffin

John P Snyder

Jeffery W Butterbaugh

Kevin L Siefering

David C Gray

Fred C Hiatt

John C Patrin

An dynamic electronic communication device. The tag according to embodiments of the invention is designed or set to discount, promote, incentivize, or apply information at certain states or within a certain timeframe at initial deployment, the tags themselves being capable of handling the logic. The tag generally includes a circuit, such as a silicon chip, that controls a flexible printed display, which displays the information when applied. The tag is optionally encapsulated in a plastic or glass case. The tag is made of a suitably small size such that the tag can easily be placed on individual items, and can be secured to other objects via an adhesive backing, sewn in, pinned on, and the like.

Dynamic electronic communication device

Systems and methods of fabricating silicon-based thin film transistors (TFTs) on flexible substrates. The systems and methods incorporate and combine deposition processes such as chemical vapor deposition and plasma-enhance vapor deposition, printing, coating, and other deposition processes, with laser annealing, etching techniques, and laser doping, all performed at low temperatures such that the precision, resolution, and registration is achieved to produce a high performing transistor. Such TFTs can be used in applications such as displays, packaging, labeling, and the like.

Silicon thin film transistors, systems, and methods of making same

Printing plates, printing system and method for printing electrical circuits. According to embodiments of the invention, patterned layers of conductive, insulating, semi-conductive materials, and other materials can be additively print deposited on a substrate to form electrical circuits. The electrical circuits so formed of single or multiple printed layers can comprise or compose transistor devices, including thin film transistors, multiple transistor circuits or assemblies, or other electrical devices, for example batteries, sensors, displays, memory arrays, and the like. The invention further provides a patterned printing plate imaged by a photolithography and etch process, and a printing system and methods using the patterned plate by which such high resolution, precise registration electrical circuits and circuit devices can be produced.

Patterned printing plates and processes for printing electrical elements

Apparatus and process for conditioning a generally planar substrate, contained in a chamber isolatable from the ambient environment and fed with a conditioning gas which includes reactive gas. The apparatus includes a support for supporting the substrate in the chamber, the substrate being in a lower pressure reaction region of the chamber. A gas inlet is provided for feeding conditioning gas into a gas inlet region of the chamber which is at a higher pressure than the lower pressure reaction region so that the pressure differential causes the conditioning gas to flow toward the surface of the substrate wherein the conditioning gas component will chemically react with and condition the substrate surface, both said higher and lower pressure regions operating in a viscous flow regime. The substrate is supported such that a pressure bias is created across the surface of this substrate so that the gas, after it has chemically reacted with the substrate surface, flows outward from where it has reacted, off the substrate toward the periphery of the chamber and out a peripheral or central underside exhaust outlet. Gas feed may be provided to one or both sides the substrate and light activation of the substrate or conditioning gas may be provided on one or both sides.

Apparatus for surface conditioning

Apparatus and method for direct delivery of enabling chemical gas from a liquid source and of HF gas in a hydrogen fluoride/enabling chemical based cleaning or etching process, such as a silicon dioxide film etching process. The liquid enabling chemical is temperature controlled to generate a vapor pressure which is sufficient to operate a mass flow controller at a desired processing pressure without a carrier gas. Prior to entering the process chamber, the enabling chemical gas is pre-mixed with HF and optionally, a carrier gas, all of which are supplied at flow rates independent of each other. By controlling the vapor pressure of the solvent in this way, solvent/HF/carrier mixtures which are not physically possible with carrier gas systems are attainable allowing access to a larger process space.

Direct vapor delivery of enabling chemical for enhanced HF etch process performance

Method and apparatus for surface conditioning

A substrate may be treated by impinging the substrate with a cryogenic aerosol spray wherein the cryogenic aerosol spray is formed by expanding a pressurized liquid or liquid/gaseous stream of one or more cryogens through a nozzle at a given distance from the substrate into a process chamber with a pressure of about 1.6.times.10.sup.4 Pascal or less so as to form at least substantially solid aerosol particles of said one or more cryogens downstream from the nozzle by the cooling resulting from the expansion and/or evaporation to form an at least substantially solid particle containing aerosol.

Growing community of inventors

St. Louis Park, MN, United States of America

John M Heitzinger